SLLSFF5H January   2020  – May 2022 ISO6720-Q1 , ISO6721-Q1 , ISO6721R-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Description (continued)
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Power Ratings
    6.     Insulation Specifications
    7. 7.6  Safety-Related Certifications
    8. 7.7  Safety Limiting Values
    9.     Electrical Characteristics—5-V Supply
    10. 7.8  Supply Current Characteristics—5-V Supply
    11. 7.9  Electrical Characteristics—3.3-V Supply
    12. 7.10 Supply Current Characteristics—3.3-V Supply
    13. 7.11 Electrical Characteristics—2.5-V Supply 
    14. 7.12 Supply Current Characteristics—2.5-V Supply
    15.     Electrical Characteristics—1.8-V Supply
    16. 7.13 Supply Current Characteristics—1.8-V Supply
    17. 7.14 Switching Characteristics—5-V Supply
    18. 7.15 Switching Characteristics—3.3-V Supply
    19. 7.16 Switching Characteristics—2.5-V Supply
    20. 7.17 Switching Characteristics—1.8-V Supply
    21. 7.18 Insulation Characteristics Curves
    22. 7.19 Typical Characteristics
  8. 8 Parameter Measurement Information
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Electromagnetic Compatibility (EMC) Considerations
    4. 9.4 Device Functional Modes
      1. 9.4.1 Device I/O Schematics
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
      3. 10.2.3 Application Curve
    3. 10.3 Insulation Lifetime
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
      1. 12.1.1 PCB Material
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Device Support
      1. 13.1.1 Development Support
    2. 13.2 Documentation Support
      1. 13.2.1 Related Documentation
    3. 13.3 Receiving Notification of Documentation Updates
    4. 13.4 Support Resources
    5. 13.5 Trademarks
    6. 13.6 Electrostatic Discharge Caution
    7. 13.7 Glossary
  14. 14Mechanical, Packaging, and Orderable Information
    1. 14.1 Package Option Addendum
    2. 14.2 Tape and Reel Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9.1 Overview

The ISO672x-Q1family of devices has an ON-OFF keying (OOK) modulation scheme to transmit the digital data across a silicon dioxide based isolation barrier. The transmitter sends a high frequency carrier across the barrier to represent one digital state and sends no signal to represent the other digital state. The receiver demodulates the signal after advanced signal conditioning and produces the output through a buffer stage. These devices also incorporate advanced circuit techniques to maximize the CMTI performance and minimize the radiated emissions due the high frequency carrier and IO buffer switching. The conceptual block diagram of a digital capacitive isolator, Figure 9-1, shows a functional block diagram of a typical channel.