SLLSEF1B September   2013  – August 2015 ISO7142CC

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics, 5 V
    6. 6.6  Electrical Characteristics, 3.3 V
    7. 6.7  Electrical Characteristics, 2.7 V
    8. 6.8  Power Dissipation Characteristics
    9. 6.9  Switching Characteristics, 5 V
    10. 6.10 Switching Characteristics, 3.3 V
    11. 6.11 Switching Characteristics, 2.7 V
    12. 6.12 Supply Current, 5 V
    13. 6.13 Supply Current, 3.3 V
    14. 6.14 Supply Current, 2.7 V
    15. 6.15 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Insulation and Safety-Related Specifications
      2. 8.3.2 Regulatory Information
      3. 8.3.3 Safety Limiting Values
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 PCB Material
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Community Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Specifications

6.1 Absolute Maximum Ratings(1)

MIN MAX UNIT
VCC1, VCC2 Supply voltage(2) –0.5 6 V
V Voltage at INx, OUTx, ENx –0.5 VCC + 0.5(3) V
IO Output current -15 15 mA
TJ Maximum junction temperature 150 °C
Tstg Storage temperature –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values except differential I/O bus voltages are with respect to the local ground terminal (GND1 or GND2) and are peak voltage values.
(3) Maximum voltage must not exceed 6 V.

6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±4000 V
Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±1500
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

MIN NOM MAX UNIT
VCC1, VCC2 Supply voltage 2.7 5.5 V
IOH High-level output current (VCC ≥ 3.0 V) –4 mA
High-level output current (VCC < 3.0 V) –2
IOL Low-level output current 4 mA
VIH High-level input voltage 2 5.5 V
VIL Low-level input voltage 0 0.8 V
tui Input pulse duration (VCC ≥ 4.5V) 20 ns
Input pulse duration (VCC < 4.5V) 25
1 / tui Signaling rate (VCC ≥ 4.5V) 0 50 Mbps
Signaling rate (VCC < 4.5V) 0 40
TJ Junction temperature 136 °C
TA Ambient temperature –55 25 125 °C

6.4 Thermal Information

THERMAL METRIC(1) ISO7142CC UNIT
DBQ (SSOP)
16 PINS
RθJA Junction-to-ambient thermal resistance 104.5 °C/W
RθJC(top) Junction-to-case(top) thermal resistance 57.8 °C/W
RθJB Junction-to-board thermal resistance 46.8 °C/W
ψJT Junction-to-top characterization parameter 18.3 °C/W
ψJB Junction-to-board characterization parameter 46.4 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.

6.5 Electrical Characteristics, 5 V

VCC1 and VCC2 at 5 V ± 10% (over recommended operating conditions unless otherwise noted.)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VOH High-level output voltage IOH = –4 mA; see Figure 8 VCCO(1) – 0.5 V
IOH = –20 μA; see Figure 8 VCCO – 0.1
VOL Low-level output voltage IOL = 4 mA; see Figure 8 0.4 V
IOL = 20 μA; see Figure 8 0.1
VI(HYS) Input threshold voltage hysteresis 480 mV
IIH High-level input current VIH = VCCI(1) at INx or ENx 10 μA
IIL Low-level input current VIL = 0 V at INx or ENx –10
CMTI Common-mode transient immunity VI = VCCI or 0 V; see Figure 11 25 70 kV/μs
(1) VCCI= Supply voltage for the input channel; VCCO = Supply voltage for the output channel

6.6 Electrical Characteristics, 3.3 V

VCC1 and VCC2 at 3.3 V ± 10% (over recommended operating conditions unless otherwise noted.)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VOH High-level output voltage IOH = –4 mA; see Figure 8 VCCO(1) – 0.5 V
IOH = –20 μA; see Figure 8 VCCO – 0.1
VOL Low-level output voltage IOL = 4 mA; see Figure 8 0.4 V
IOL = 20 μA; see Figure 8 0.1
VI(HYS) Input threshold voltage hysteresis 460 mV
IIH High-level input current VIH = VCCI(1) at INx or ENx 10 μA
IIL Low-level input current VIL = 0 V at INx or ENx –10
CMTI Common-mode transient immunity VI = VCCI or 0 V; see Figure 11 25 50 kV/μs
(1) VCCI= Supply voltage for the input channel; VCCO = Supply voltage for the output channel

6.7 Electrical Characteristics, 2.7 V

VCC1 and VCC2 at 2.7 V (over recommended operating conditions unless otherwise noted.)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VOH High-level output voltage IOH = –2 mA; see Figure 8 VCCO(1) – 0.3 V
IOH = –20 μA; see Figure 8 VCCO – 0.1
VOL Low-level output voltage IOL = 4 mA; see Figure 8 0.4 V
IOL = 20 μA; see Figure 8 0.1
VI(HYS) Input threshold voltage hysteresis 360 mV
IIH High-level input current VIH = VCCI(1) at INx or ENx 10 μA
IIL Low-level input current VIL = 0 V at INx or ENx -10
CMTI Common-mode transient immunity VI = VCCI or 0 V; see Figure 11 25 45 kV/μs
(1) VCCI= Supply voltage for the input channel; VCCO = Supply voltage for the output channel

6.8 Power Dissipation Characteristics

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
PD Device power dissipation VCC1 = VCC2 = 5.5 V, TJ = 150°C, CL = 15 pF
Input a 25-MHz, 50% duty cycle square wave		 170 mW

6.9 Switching Characteristics, 5 V

VCC1 and VCC2 at 5 V ± 10% (over recommended operating conditions unless otherwise noted.)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
tPLH, tPHL Propagation delay time See Figure 8 15 21 38 ns
PWD(1) Pulse width distortion |tPHL – tPLH| See Figure 8 3.5 ns
tsk(o)(2) Channel-to-channel output skew time Same-direction channels 1.5 ns
Opposite-direction channels 6.5
tsk(pp)(3) Part-to-part skew time 14 ns
tr Output signal rise time See Figure 8 2.5 ns
tf Output signal fall time See Figure 8 2.1 ns
tPHZ, tPLZ Disable propagation delay, high/low-to-high impedance output See Figure 9 7 12 ns
tPZH Enable propagation delay, high impedance-to-high output See Figure 9 6 12 ns
tPZL Enable propagation delay, high impedance-to-low output See Figure 9 12 23 us
tfs Fail-safe output delay time from input data or power loss See Figure 10 8 μs
tGR Input glitch rejection time 9.5 ns
(1) Also known as pulse skew
(2) tsk(o) is the skew between outputs of a single device with all driving inputs connected together and the outputs switching in the same direction while driving identical loads.
(3) tsk(pp) is the magnitude of the difference in propagation delay times between any terminals of different devices switching in the same direction while operating at identical supply voltages, temperature, input signals, and loads.

6.10 Switching Characteristics, 3.3 V

VCC1 and VCC2 at 3.3 V ± 10% (over recommended operating conditions unless otherwise noted.)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
tPLH, tPHL Propagation delay time See Figure 8 16 25 46 ns
PWD(1) Pulse width distortion |tPHL – tPLH| See Figure 8 3 ns
tsk(o)(2) Channel-to-channel output skew time Same-direction Channels 2 ns
Opposite-direction Channels 6.5
tsk(pp)(3) Part-to-part skew time 21 ns
tr Output signal rise time See Figure 8 3 ns
tf Output signal fall time See Figure 8 2.5 ns
tPHZ, tPLZ Disable propagation delay, from high/low to high-impedance output See Figure 9 9 14 ns
tPZH Enable propagation delay, from high-impedance to high output See Figure 9 9 17 ns
tPZL Enable propagation delay, from high-impedance to low output See Figure 9 12 24 us
tfs Fail-safe output delay time from input data or power loss See Figure 10 7 μs
tGR Input glitch rejection time 11 ns
(1) Also known as pulse skew
(2) tsk(o) is the skew between outputs of a single device with all driving inputs connected together and the outputs switching in the same direction while driving identical loads.
(3) tsk(pp) is the magnitude of the difference in propagation delay times between any terminals of different devices switching in the same direction while operating at identical supply voltages, temperature, input signals and loads.

6.11 Switching Characteristics, 2.7 V

VCC1 and VCC2 at 2.7 V (over recommended operating conditions unless otherwise noted.)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
tPLH, tPHL Propagation delay time See Figure 8 18 28 50 ns
PWD(1) Pulse width distortion |tPHL – tPLH| See Figure 8 3 ns
tsk(o)(2) Channel-to-channel output skew time Same-direction Channels 3 ns
Opposite-direction Channels 8.5 ns
tsk(pp)(3) Part-to-part skew time 24 ns
tr Output signal rise time See Figure 8 3.5 ns
tf Output signal fall time See Figure 8 2.8 ns
tPHZ, tPLZ Disable propagation delay, from high/low to high-impedance output See Figure 9 10 15 ns
tPZH Enable propagation delay, from high-impedance to high output See Figure 9 10 19 ns
tPZL Enable propagation delay, from high-impedance to low output See Figure 9 12 23 us
tfs Fail-safe output delay time from input data or power loss See Figure 10 7 μs
tGR Input glitch rejection time 12 ns
(1) Also known as pulse skew
(2) tsk(o) is the skew between outputs of a single device with all driving inputs connected together and the outputs switching in the same direction while driving identical loads.
(3) tsk(pp) is the magnitude of the difference in propagation delay times between any terminals of different devices switching in the same direction while operating at identical supply voltages, temperature, input signals, and loads.

6.12 Supply Current, 5 V

VCC1 and VCC2 at 5 V ± 10% (over recommended operating conditions unless otherwise noted.)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
ICC1, ICC2 Disable EN1 = EN2 = 0 V 0.8 1.6 mA
ICC1 , ICC2 DC to 1 Mbps DC Signal: VI = VCCI or 0 V,
AC Signal: All channels switching with square wave clock input; CL = 15 pF		 3.3 5
ICC1, ICC2 10 Mbps 4.9 7
ICC1, ICC2 25 Mbps 7.3 10
ICC1, ICC2 50 Mbps 11.1 14.5

6.13 Supply Current, 3.3 V

VCC1 and VCC2 at 3.3 V ± 10% (over recommended operating conditions unless otherwise noted.)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
ICC1, ICC2 Disable EN1 = EN2 = 0 V 0.5 1 mA
ICC1, ICC2 DC to 1 Mbps DC signal: VI = VCCI or 0 V
AC signal: All channels switching with square-wave clock input; CL = 15 pF		 2.5 4
ICC1, ICC2 10 Mbps 3.5 5
ICC1, ICC2 25 Mbps 5 7
ICC1, ICC2 40 Mbps 6.5 10

6.14 Supply Current, 2.7 V

VCC1 and VCC2 at 2.7 V (over recommended operating conditions unless otherwise noted.)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
ICC1, ICC2 Disable EN1 = EN2 = 0 V 0.4 0.8 mA
ICC1, ICC2 DC to 1 Mbps DC signal: VI = VCCI or 0 V
AC signal: All channels switching with square-wave clock input; CL = 15 pF		 2.2 3.5
ICC1, ICC2 10 Mbps 3 4.2
ICC1, ICC2 25 Mbps 4.2 5.5
ICC1, ICC2 40 Mbps 5.4 7.5

6.15 Typical Characteristics

ISO7142CC C001_SLLSEF1.png
Figure 1. ISO7142 Supply Current for All Channels vs Data Rate
ISO7142CC C003_SLLSEF1.png
Figure 3. Low-Level Output Voltage
vs Low-Level Output Current
ISO7142CC C005_SLLSEF1.png
Figure 5. Propagation Delay Time
vs Free-Air Temperature
ISO7142CC C007_SLLSEF1.png
Figure 7. Peak-Peak Output Jitter vs Data Rate
ISO7142CC C002_SLLSEF1.png
Figure 2. High-Level Output Voltage
vs High-Level Output Current
ISO7142CC C004_SLLSEF1.gif
Figure 4. VCC Undervoltage Threshold
vs Free-Air Temperature
ISO7142CC C006_SLLSEF1.png
Figure 6. Input Glitch Rejection Time
vs Free-Air Temperature