SLLSEU0F november   2016  – august 2023 ISO7740-Q1 , ISO7741-Q1 , ISO7742-Q1

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Revision History
  6. Pin Configuration and Functions
    1.     Pin Functions
  7. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Power Ratings
    6. 6.6  Insulation Specifications
    7. 6.7  Safety-Related Certifications
    8. 6.8  Safety Limiting Values
    9. 6.9  Electrical Characteristics—5-V Supply
    10. 6.10 Supply Current Characteristics—5-V Supply
    11. 6.11 Electrical Characteristics—3.3-V Supply
    12. 6.12 Supply Current Characteristics—3.3-V Supply
    13. 6.13 Electrical Characteristics—2.5-V Supply 
    14. 6.14 Supply Current Characteristics—2.5-V Supply
    15. 6.15 Switching Characteristics—5-V Supply
    16. 6.16 Switching Characteristics—3.3-V Supply
    17. 6.17 Switching Characteristics—2.5-V Supply
    18. 6.18 Insulation Characteristics Curves
    19. 6.19 Typical Characteristics
  8. Parameter Measurement Information
  9. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Electromagnetic Compatibility (EMC) Considerations
    4. 8.4 Device Functional Modes
      1. 8.4.1 Device I/O Schematics
  10. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
        1. 9.2.3.1 Insulation Lifetime
  11. 10Power Supply Recommendations
  12. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 PCB Material
    2. 11.2 Layout Example
  13. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Related Links
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 Support Resources
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  14. 13Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DBQ|16
  • DWW|16
  • DW|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Description

The ISO774x-Q1 automotive devices are high-performance, quad-channel digital isolators with 5700 VRMS (DWW package), 5000 VRMS (DW package) and 3000 VRMS (DBQ package) isolation ratings per UL 1577. This family of devices has reinforced insulation ratings according to VDE, CSA, TUV and CQC.

The ISO774x-Q1 devices provide high electromagnetic immunity and low emissions at low power consumption, while isolating CMOS or LVCMOS digital I/Os. Each isolation channel has a logic input and output buffer separated by a double capacitive silicon dioxide (SiO2) insulation barrier. These devices come with enable pins which can be used to put the respective outputs in high impedance for multi-master driving applications and to reduce power consumption. The ISO7740-Q1 device has all four channels in the same direction, the ISO7741-Q1 device has three forward and one reverse-direction channels, and the ISO7742-Q1 device has two forward and two reverse-direction channels. If the input power or signal is lost, default output is high for devices without suffix F and low for devices with suffix F. See the Device Functional Modes section for further details.

Used in conjunction with isolated power supplies, these devices help prevent noise currents on data buses, such as CAN and LIN, or other circuits from entering the local ground and interfering with or damaging sensitive circuitry. Through innovative chip design and layout techniques, electromagnetic compatibility of the ISO774x-Q1 devices have been significantly enhanced to ease system-level ESD, EFT, surge, and emissions compliance. The ISO774x-Q1 devicesare available in 16-pin wide SOIC (DW) and QSOP (DBQ) packages. ISO7741-Q1 is also available in extra-wide SOIC (DWW) package.

Device Information
PART NUMBER(1)PACKAGEBODY SIZE (NOM)
ISO7741-Q1SOIC (DWW)10.30 mm × 14.0 mm
ISO7740-Q1
ISO7741-Q1
ISO7742-Q1
SOIC (DW)10.30 mm × 7.50 mm
SSOP (DBQ)4.90 mm × 3.90 mm
For all available packages, see the orderable addendum at the end of the data sheet.
GUID-6AF0F792-D46B-43DD-B1F7-97F693A451EE-low.gif
VCCI=Input supply, VCCO=Output supply
GNDI=Input ground, GNDO=Output ground
Simplified Schematic