SLLSEU0C November   2016  – February 2020 ISO7740-Q1 , ISO7741-Q1 , ISO7742-Q1

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
    1.     Simplified Schematic
  4. Revision History
  5. Description Continued
  6. Pin Configuration and Functions
    1.     Pin Functions
  7. Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Power Rating
    6. 7.6  Insulation Specifications
    7. 7.7  Safety-Related Certifications
    8. 7.8  Safety Limiting Values
    9. 7.9  Electrical Characteristics—5-V Supply
    10. 7.10 Supply Current Characteristics—5-V Supply
    11. 7.11 Electrical Characteristics—3.3-V Supply
    12. 7.12 Supply Current Characteristics—3.3-V Supply
    13. 7.13 Electrical Characteristics—2.5-V Supply
    14. 7.14 Supply Current Characteristics—2.5-V Supply
    15. 7.15 Switching Characteristics—5-V Supply
    16. 7.16 Switching Characteristics—3.3-V Supply
    17. 7.17 Switching Characteristics—2.5-V Supply
    18. 7.18 Insulation Characteristics Curves
    19. 7.19 Typical Characteristics
  8. Parameter Measurement Information
  9. Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1 Electromagnetic Compatibility (EMC) Considerations
    4. 9.4 Device Functional Modes
      1. 9.4.1 Device I/O Schematics
  10. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Design Requirements
      2. 10.2.2 Detailed Design Procedure
      3. 10.2.3 Application Curve
        1. 10.2.3.1 Insulation Lifetime
  11. 11Power Supply Recommendations
  12. 12Layout
    1. 12.1 Layout Guidelines
      1. 12.1.1 PCB Material
    2. 12.2 Layout Example
  13. 13Device and Documentation Support
    1. 13.1 Documentation Support
      1. 13.1.1 Related Documentation
    2. 13.2 Related Links
    3. 13.3 Receiving Notification of Documentation Updates
    4. 13.4 Community Resources
    5. 13.5 Trademarks
    6. 13.6 Electrostatic Discharge Caution
    7. 13.7 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DBQ|16
  • DWW|16
  • DW|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Safety Limiting Values

Safety limiting(1) intends to minimize potential damage to the isolation barrier upon failure of input or output circuitry. A failure of the I/O can allow low resistance to ground or the supply and, without current limiting, dissipate sufficient power to overheat the die and damage the isolation barrier potentially leading to secondary system failures.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
DWW-16 PACKAGE
IS Safety input, output, or supply current RθJA = 58.3 °C/W, VI = 5.5 V, TJ = 150°C, TA = 25°C, see Figure 1 390 mA
RθJA = 58.3 °C/W, VI = 3.6 V, TJ = 150°C, TA = 25°C, see Figure 1 596
RθJA = 58.3 °C/W, VI = 2.75 V, TJ = 150°C, TA = 25°C, see Figure 1 780
PS Safety input, output, or total power RθJA = 58.3 °C/W, TJ = 150°C, TA = 25°C, see Figure 4 2144 mW
TS Maximum safety temperature 150 °C
DW-16 PACKAGE
IS Safety input, output, or supply current RθJA = 83.4 °C/W, VI = 5.5 V, TJ = 150°C, TA = 25°C, see Figure 2 273 mA
RθJA = 83.4 °C/W, VI = 3.6 V, TJ = 150°C, TA = 25°C, see Figure 2 416
RθJA = 83.4 °C/W, VI = 2.75 V, TJ = 150°C, TA = 25°C, see Figure 2 545
PS Safety input, output, or total power RθJA = 83.4 °C/W, TJ = 150°C, TA = 25°C, see Figure 5 1499 mW
TS Maximum safety temperature 150 °C
DBQ-16 PACKAGE
IS Safety input, output, or supply current RθJA = 109 °C/W, VI = 5.5 V, TJ = 150°C, TA = 25°C, see Figure 3 209 mA
RθJA = 109 °C/W, VI = 3.6 V, TJ = 150°C, TA = 25°C, see Figure 3 319
RθJA = 109 °C/W, VI = 2.75 V, TJ = 150°C, TA = 25°C, see Figure 3 417
PS Safety input, output, or total power RθJA = 109 °C/W, TJ = 150°C, TA = 25°C, see Figure 6 1147 mW
TS Maximum safety temperature 150 °C
The maximum safety temperature is the maximum junction temperature specified for the device. The power dissipation and junction-to-air thermal impedance of the device installed in the application hardware determines the junction temperature. The assumed junction-to-air thermal resistance in the Thermal Information is that of a device installed on a High-K test board for leaded Surface Mount Packages. The power is the recommended maximum input voltage times the current. The junction temperature is then the ambient temperature plus the power times the junction-to-air thermal resistance