SLLSEP1C July   2015  – July 2025 ISO7810

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Power Rating
    6. 5.6  Insulation Specifications
    7. 5.7  Safety-Related Certifications
    8. 5.8  Safety Limiting Values
    9. 5.9  Electrical Characteristics—5-V Supply
    10. 5.10 Supply Current Characteristics—5-V Supply
    11. 5.11 Electrical Characteristics—3.3-V Supply
    12. 5.12 Supply Current Characteristics—3.3-V Supply
    13. 5.13 Electrical Characteristics—2.5-V Supply
    14. 5.14 Supply Current Characteristics—2.5-V Supply
    15. 5.15 Switching Characteristics—5-V Supply
    16. 5.16 Switching Characteristics—3.3-V Supply
    17. 5.17 Switching Characteristics—2.5-V Supply
    18. 5.18 Insulation Characteristics Curves
    19. 5.19 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Electromagnetic Compatibility (EMC) Considerations
    4. 7.4 Device Functional Modes
      1. 7.4.1 Device I/O Schematics
  9. 8 Applications and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
      4. 8.2.4 Power Supply Recommendations
      5. 8.2.5 Layout
        1. 8.2.5.1 Layout Guidelines
          1. 8.2.5.1.1 PCB Material
        2. 8.2.5.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Related Links
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Trademarks
    7. 9.7 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DWW|16
  • DW|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10 Revision History

Changes from Revision B (June 2016) to Revision C (April 2025)

  • Updated the numbering format for tables, figures, and cross-references throughout the documentGo
  • Added 15mm (typical) specificaion for CPG/CLR in the Insulation Specifications TableGo

Changes from Revision A (September 2015) to Revision B (June 2016)

  • Changed Section 1 From: Low Power Consumption, Typical 1.8mA per Channel at 1Mbps To: Low Power Consumption, Typical 1.8mA at 1MbpsGo
  • Changed Section 1 From: Low Propagation Delay: 11ns Typical To: Low Propagation Delay: 10.7ns Typical Go
  • Changed Section 1 From: Safety and Regulatory Approvals To: Safety-Related Certifications Go
  • Added the extra-wide body package (16 pin SOIC [DWW]) optionGo
  • Changed the INA, OUTA, VCCI, and VCCO pin names to IN, OUT, VCC1, and VCC2 (respectively) and updated the pin out drawings, Pin Functions table, and other figures to match Go
  • Moved Junction temperature From Section 5.3 To Section 5.1 Go
  • Changed the Thermal Information values for the DW package and add the values for the DWW package Go
  • Changed the values in the Power Rating table Go
  • Moved Section 5.6 to the Section 5 section Go
  • Changed CIO Specification From: 2 pF To: ≅0.75 pF Go
  • Moved Section 5.7 to the Section 5 section Go
  • Moved Section 5.8 to the Section 5 section Go
  • Changed the minimum CMTI value from 50 to 100 and deleted the maximum value in the 5-V and 3.3-V electrical characteristics tables. Also added VCM to the test conditionsGo
  • Changed the maximum value for the supply current, AC parameter at 100 Mbps in all of the electrical characteristics tables Go
  • Changed the minimum CMTI value from 70 to 100 and deleted the maximum value in the 2.5-V electrical characteristics table. Also added VCM to the test conditionsGo
  • Added the disable and enable propagation delay parameters to all of the switching characteristics tables Go
  • Changed tfs To: tDO in Section 5.15 Go
  • Changed tfs To: tDO in Section 5.16 Go
  • Changed tfs To: tDO in Section 5.17 Go
  • Added the Section 5.18 sectionGo
  • Added the lifetime projection curves for the DW and DWW packages in the Section 5.18 sectionGo
  • Added Default Output Delay Time Test Circuit and Voltage Waveforms in the Parameter Measurement Section section Go
  • Changed text "dual-channel digital isolator" To: "single-channel digital isolator" in Section 8.1 Go
  • Changed text "DC-DC converters" To: "transformer driver" in the Section 8.2 sectionGo
  • Changed Figure 8-1 Go

Changes from Revision * (July 2015) to Revision A (September 2015)

  • Changed From: 1-page Product Preview To: Production data sheet Go