SLLSEP1B July   2015  – June 2016 ISO7810

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Power Rating
    6. 6.6  Insulation Characteristics
    7. 6.7  Regulatory Information
    8. 6.8  Safety Limiting Values
    9. 6.9  Electrical Characteristics—5-V Supply
    10. 6.10 Supply Current Characteristics—5-V Supply
    11. 6.11 Electrical Characteristics—3.3-V Supply
    12. 6.12 Supply Current Characteristics—3.3-V Supply
    13. 6.13 Electrical Characteristics—2.5-V Supply
    14. 6.14 Supply Current Characteristics—2.5-V Supply
    15. 6.15 Switching Characteristics—5-V Supply
    16. 6.16 Switching Characteristics—3.3-V Supply
    17. 6.17 Switching Characteristics—2.5-V Supply
    18. 6.18 Insulation Characteristics Curves
    19. 6.19 Typical Characteristics
  7. Parameter Measurement Information
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Electromagnetic Compatibility (EMC) Considerations
    4. 8.4 Device Functional Modes
      1. 8.4.1 Device I/O Schematics
  9. Applications and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 PCB Material
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Related Links
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 Community Resources
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DWW|16
  • DW|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

1 Features

  • Signaling Rate: Up to 100 Mbps
  • Wide Supply Range: 2.25 V to 5.5 V
  • 2.25 V to 5.5 V Level Translation
  • Wide Temperature Range: –55°C to 125°C
  • Low Power Consumption, Typical 1.8 mA at
    1 Mbps
  • Low Propagation Delay: 10.7 ns Typical
    (5 V Supplies)
  • Industry leading CMTI (Min): ±100 kV/μs
  • Robust Electromagnetic Compatibility (EMC)
  • System-Level ESD, EFT, and Surge Immunity
  • Low Emissions
  • Isolation Barrier Life: > 40 Years
  • SOIC-16 Wide Body (DW) and Extra-Wide Body (DWW) Package Options
  • Safety-Related Certifications:
    • 8000 VPK Reinforced Isolation per DIN V VDE V 0884-10 (VDE V 0884-10):2006-12
    • 5.7 kVRMS Isolation for 1 minute per UL 1577
    • CSA Component Acceptance Notice 5A, IEC 60950-1 and IEC 60601-1 End Equipment Standards
    • CQC Certification per GB4943.1-2011
    • TUV Certification per EN 61010-1 and EN 60950-1
    • All DW Package Certifications Complete; DWW Package Certifications Complete per UL, VDE, and TUV and Planned for CSA and CQC

2 Applications

  • Industrial Automation
  • Motor Control
  • Power Supplies
  • Solar Inverters
  • Medical Equipment
  • Hybrid Electric Vehicles

3 Description

The ISO7810x device is a high-performance, single-channel digital isolator with 8000 VPK isolation voltage. This device has reinforced isolation certifications according to VDE, CSA, CQC, and TUV. The isolator provides high electromagnetic immunity and low emissions at low power consumption, while isolating CMOS or LVCMOS digital I/Os.

The isolation channel has a logic input and output buffer separated by silicon dioxide (SiO2) insulation barrier. If the input power or signal is lost, the default output is high for the ISO7810 and low for the ISO7810F device. See the Device Functional Modes section for further details.

Used in conjunction with isolated power supplies, this device helps prevent noise currents on a data bus or other circuits from entering the local ground and interfering with or damaging sensitive circuitry. Through innovative chip design and layout techniques, electromagnetic compatibility of the ISO7810x device has been significantly enhanced to ease system-level ESD, EFT, surge, and emissions compliance. The ISO7810x device is available in 16-pin SOIC wide-body (DW) and extra-wide body (DWW) packages.The DWW package option comes with enable pin which can be used to put the output in high impedance state for multi-master driving applications and to reduce power consumption.

Device Information(1)

PART NUMBER PACKAGE BODY SIZE (NOM)
ISO7810
ISO7810F
DW (16) 10.30 mm × 7.50 mm
DWW (16) 10.30 mm × 14.0 mm
  1. For all available packages, see the orderable addendum at the end of the datasheet.

Simplified Schematic

ISO7810 ISO7810F fp_simple_schematic_sllsep1.gif

4 Revision History

Changes from A Revision (September 2015) to B Revision

Changes from * Revision (July 2015) to A Revision

  • Changed From: 1-page Product Preview To: Production datasheet Go