SLLSEM2I November   2014  – September 2026 ISO7821

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Power Ratings
    6. 5.6  Insulation Specifications
    7. 5.7  Safety-Related Certifications
    8. 5.8  Safety Limiting Values
    9. 5.9  Electrical Characteristics, 5V
    10. 5.10 Electrical Characteristics, 3.3V
    11. 5.11 Electrical Characteristics, 2.5V
    12. 5.12 Switching Characteristics, 5V
    13. 5.13 Switching Characteristics, 3.3V
    14. 5.14 Switching Characteristics, 2.5V
    15. 5.15 Insulation Characteristics Curves
    16. 5.16 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
      1. 7.4.1 Device I/O Schematics
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Electromagnetic Compatibility (EMC) Considerations
      3. 8.2.3 Application Performance Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 PCB Material
      2. 8.4.2 Layout Guidelines
      3. 8.4.3 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Related Documentation
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DWW|16
  • DW|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.8 Safety Limiting Values

Safety limiting intends to prevent potential damage to the isolation barrier upon failure of input or output circuitry. A failure of the I/O can allow low resistance to ground or the supply and, without current limiting, dissipate sufficient power to overheat the die and damage the isolation barrier potentially leading to secondary system failures.

Table 5-1 Safety Limiting
PARAMETERTEST CONDITIONSMINTYPMAXUNIT
ISSafety input, output, or supply current for DW-16 package and DWW-16 PackagesRθJA = 84.7°C/W, VI = 5.5V, TJ = 150°C, TA = 25°C. See also Figure 5-1268mA
RθJA = 84.7°C/W, VI = 3.6V, TJ = 150°C, TA = 25°C. See also Figure 5-1410
RθJA = 84.7°C/W, VI = 2.75V, TJ = 150°C, TA = 25°C. See also Figure 5-1537
PSSafety input, output, or total powerRθJA = 84.7°C/W, TJ = 150°C, TA = 25°C. See also Figure 5-21476mW
TSMaximum safety temperature150°C

The maximum safety temperature is the maximum junction temperature specified for the device. The power dissipation and junction-to-air thermal impedance of the device installed in the application hardware determines the junction temperature. The assumed junction-to-air thermal resistance in the Thermal Information section is that of a device installed on a High-K test board for Leaded Surface Mount Packages. The power is the recommended maximum input voltage times the current. The junction temperature is then the ambient temperature plus the power times the junction-to-air thermal resistance.