SLLSEM2I November   2014  – September 2026 ISO7821

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Power Ratings
    6. 5.6  Insulation Specifications
    7. 5.7  Safety-Related Certifications
    8. 5.8  Safety Limiting Values
    9. 5.9  Electrical Characteristics, 5V
    10. 5.10 Electrical Characteristics, 3.3V
    11. 5.11 Electrical Characteristics, 2.5V
    12. 5.12 Switching Characteristics, 5V
    13. 5.13 Switching Characteristics, 3.3V
    14. 5.14 Switching Characteristics, 2.5V
    15. 5.15 Insulation Characteristics Curves
    16. 5.16 Typical Characteristics
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
      1. 7.4.1 Device I/O Schematics
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Electromagnetic Compatibility (EMC) Considerations
      3. 8.2.3 Application Performance Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 PCB Material
      2. 8.4.2 Layout Guidelines
      3. 8.4.3 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Related Documentation
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DWW|16
  • DW|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.3 Recommended Operating Conditions

MINTYPMAXUNIT
VCC1, VCC2Supply voltage2.255.5V
IOHHigh-level output currentVCCO(2) = 5V-4mA
VCCO = 3.3V-2
VCCO = 2.5V-1
IOLLow-level output currentVCCO = 5V4mA
VCCO = 3.3V2
VCCO = 2.5V1
VIHHigh-level input voltage0.7 × VCCI(2)VCCIV
VILLow-level input voltage00.3 × VCCIV
DRSignaling rate0100Mbps
TJJunction temperature(1)-55150°C
TAAmbient temperature-5525125°C
(1) To maintain the recommended operating conditions for TJ, see the Thermal Information table.
(2) VCCI = Input-side VCC; VCCO = Output-side VCC.