SLLSFN1A May   2021  – August 2026 ISOS141-SEP

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Power Ratings
    6. 5.6  Insulation Specifications
    7. 5.7  Safety-Related Certifications
    8. 5.8  Safety Limiting Values
    9. 5.9  Electrical Characteristics—5-V Supply
    10. 5.10 Supply Current Characteristics—5-V Supply
    11. 5.11 Electrical Characteristics—3.3-V Supply
    12. 5.12 Supply Current Characteristics—3.3-V Supply
    13. 5.13 Electrical Characteristics—2.5-V Supply 
    14. 5.14 Supply Current Characteristics—2.5-V Supply
    15. 5.15 Switching Characteristics—5-V Supply
    16. 5.16 Switching Characteristics—3.3-V Supply
    17. 5.17 Switching Characteristics—2.5-V Supply
    18. 5.18 Insulation Characteristics Curves
    19. 5.19 Typical Characteristics
  7. 6 Operating Life Deration
  8. 7 Parameter Measurement Information
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Radiation Tolerance
      2. 8.3.2 Electromagnetic Compatibility (EMC) Considerations
    4. 8.4 Device Functional Modes
      1. 8.4.1 Device I/O Schematics
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curve
        1. 9.2.3.1 Insulation Lifetime
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
        1. 9.4.1.1 PCB Material
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

1 Features

  • Radiation Tolerant
    • Total Ionizing Dose (TID) Characterized (ELDRS-Free) = 30krad(Si)
    • TID RLAT/RHA = 30krad(Si)
    • Single-Event Latch-up (SEL) Immune to LET = 43MeV⋅cm2/mg at 125°C
    • Single-Event Dielectric Rupture (SEDR) Immune (43MeV⋅cm2/mg) at 500VDC
  • Space Enhanced Plastic (Space EP)
    • Meets NASA’s ASTM E595 Outgassing Spec
    • Vendor Item Drawing (VID) V62/21610
    • Military Temp Range (-55°C to 125°C)
    • One Wafer Fabrication Site
    • One Assembly and Test Site
    • Gold Bond Wire, NiPdAu Lead Finish
    • Wafer Lot Traceability
    • Extended Product Life Cycle
    • Extended Product Change Notification
  • 600VRMS continuous working voltage
  • Safety-Related Certifications:
    • DIN EN IEC 60747-17 (VDE 0884-17)
    • UL 1577 component recognition program
  • 100Mbps data rate
  • Wide supply range: 2.25V to 5.5V
  • 2.25V to 5.5V level translation
  • Default output low
  • Low power consumption, 1.5mA per channel typical at 1Mbps
  • Low propagation delay: 10.7ns typical (5V Supplies)
  • Low channel-to-channel skew: 4ns max (5V Supplies)
  • ±100kV/μs typical CMTI
  • System-level ESD, EFT, Surge, and Magnetic Immunity
  • Small QSOP (DBQ-16) package