SNIS245B September   2025  – July 2026 ISOTMP35R-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Insulation Specification
    6. 6.6  Power Ratings
    7. 6.7  Safety-Related Certifications
    8. 6.8  Safety Limiting Values
    9. 6.9  Electrical Characteristics
    10. 6.10 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Functional Description
      1. 7.3.1 Integrated Isolation Barrier
      2. 7.3.2 Output Stage and Signal Behavior
        1. 7.3.2.1 Transfer Function
        2. 7.3.2.2 Driving Capacitive Loads
        3. 7.3.2.3 Common Mode Transient Immunity (CMTI)
      3. 7.3.3 Thermal Response
        1. 7.3.3.1 Stirred Liquid Thermal Response
        2. 7.3.3.2 Directional Thermal Response
          1. 7.3.3.2.1 Comparison to NTC Thermistors
        3. 7.3.3.3 Still Air Thermal Response
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Improving Accuracy Using Piecewise Linear Approximation
      2. 8.1.2 Output Buffering and Signal Integrity Considerations
      3. 8.1.3 ADC Interface Considerations
      4. 8.1.4 Power Supply Recommendations
      5. 8.1.5 EMI Mitigation and Filtering
        1. 8.1.5.1 Filtering Techniques
        2. 8.1.5.2 Design Guidelines for EMI Filtering
      6. 8.1.6 Insulation Lifetime
    2. 8.2 Layout
      1. 8.2.1 Layout Guidelines
      2. 8.2.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Mechanical Data
    2. 11.2 Package Option Addendum
    3. 11.3 Tape and Reel Information

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DFP|12
Thermal pad, mechanical data (Package|Pins)

8.2.2 Layout Example

ISOTMP35R-Q1 ISOTMP35R-Q1 Layout ExampleFigure 8-6 ISOTMP35R-Q1 Layout Example