SLOS010C March   1987  – August 2026 LF412

PRODUCTION DATA  

  1.   1
  2. 1Features
  3. 2Applications
  4. 3Description
  5. 4Pin Configuration and Functions
  6. 5Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 Recommended Operating Conditions
    3. 5.3 Electrical Characteristics
    4. 5.4 Operating Characteristics
    5. 5.5 Typical Characteristics
    6. 5.6 Old Versus New Die Comparison
  7. 6Device and Documentation Support
    1. 6.1 Receiving Notification of Documentation Updates
    2. 6.2 Support Resources
    3. 6.3 Trademarks
    4. 6.4 Electrostatic Discharge Caution
    5. 6.5 Glossary
  8. 7Revision History
  9. 8Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.6 Old Versus New Die Comparison

As of the publication of revision C of this datasheet, Texas Instruments has moved manufacturing of the die for LF412 to a modern fabrication site. The two different die are referred to in this document as “old” (previous fabrication site) and “new” die. The die origin can be separated from the “Chip Source Origin” (CSO) parameter in the shipping information. The old die CSO is “SHE”, for the new die the CSO is “RFB”. The old die information is in the shipping information. The old die information is maintained in this datasheet for comparison purposes, but all new manufacturing has moved to the new die.