SNVS313F December   2010  – August 2018 LM137QML

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
    1.     Device Images
      1.      Simplified Schematic
  4. Revision History
  5. Pin Configuration and Functions
    1.     Pin Functions
  6. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Quality Conformance Inspection
    6. 6.6  LM137H 883 Electrical Characteristics DC Parameters
    7. 6.7  LM137H 883 Electrical Characteristics AC Parameters
    8. 6.8  LM137K 883 Electrical Characteristics DC Parameters
    9. 6.9  LM137K 883 Electrical Characteristics AC Parameters
    10. 6.10 LM137H RH Electrical Characteristics DC Parameters 5962P9951708VXA
    11. 6.11 LM137H RH Electrical Characteristics AC Parameters 5962P9951708VXA
    12. 6.12 LM137H RH Electrical Characteristics DC Parameters Drift Values 5962P9951708VXA
    13. 6.13 LM137H RH Electrical Characteristics DC Parameters Post Radiation Limits +25°C 5962P9951708VXA
    14. 6.14 Typical Performance Characteristics
  7. Detailed Description
    1. 7.1 Functional Block Diagram
  8. Application and Implementation
    1. 8.1 Application Information and Schematic Diagram
    2. 8.2 Typical Applications
  9. Power Supply Recommendations
    1. 9.1 Thermal Regulation
  10. 10Device and Documentation Support
    1. 10.1 Receiving Notification of Documentation Updates
    2. 10.2 Community Resources
    3. 10.3 Trademarks
    4. 10.4 Electrostatic Discharge Caution
    5. 10.5 Glossary
  11. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

Thermal Information

THERMAL METRIC(1) TO-3 METAL CAN TO-39 METAL CAN UNIT
2 PINS 3 PINS
RθJA Junction-to-ambient thermal resistance 40 (Still Air) 174 (Still Air @ 0.5W) °C/W
14 (500 LFM) 64 (500 LFM @ 0.5W)
RθJC Junction-to-case thermal resistance 4 15 (@ 1.0W)
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.