10 Revision History
Changes from Revision Y (March 2025) to Revision Z (May 2025)
- Added missing Revision History entry for "Updated Thermal Information" table in revision "Y"Go
- Fixed duplicated Fig 6-4 graphGo
Changes from Revision X (October 2023) to Revision Y (March 2025)
- Removed legacy devices from Device Information table.Go
- Updated front page ESD values in Family Comparision Table
Go
- Updated Thermal Information tableGo
- Removed legacy device graphsGo
- Updated internal schematicGo
Changes from Revision W (October 2023) to Revision X (October 2023)
- Added LM339B and LM2901B to Device Information Table for SOT-23/QFNGo
Changes from Revision V (December 2022) to Revision W (October 2023)
- Updated thermal tables for new package releasesGo
- Changed Apps Input Voltage Range text to reference appnote.Go
Changes from Revision U (November 2018) to Revision V (December 2022)
- Updated the numbering format for tables, figures, and cross-references throughout the document. Go
- Added "B" version throughout. Added Device Family Table. Go
Changes from Revision T (June 2015) to Revision U (November 2018)
- Changed LM239x temperature range from 125°C to 85°C in Description sectionGo
- Changed data sheet title Go
- Changed LM293AD to LM239AD in Device Comparison
Table
Go
- Added Input Current and related footnote in Absolute Maximum Ratings
Go
- Changed layout of Recommended Operating Conditions temperatures to separate rowsGo
- Added LM2901V and LMV2901AV to LM2901 Elect Char Table title to make more clear which devices are covered.Go
- Changed "Dual" to "Quad" and removed "Absolute Maximum" wording and mention of Q100 in Overview section text.Go
- Changed and corrected text in Feature Description sectionGo
- Changed Example Values in Typical Application
Design Parameters table Go
- Added Receiving Notification of Documentation Updates sectionGo
Changes from Revision S (August 2012) to Revision T (June 2015)
- Deleted Ordering Information table. Go
- Added Military Disclaimer to Features list.Go
- Added Applications, Device Information table, Pin Configuration and Functions section, ESD Ratings table, Thermal Information table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section. No specification changes.Go