SNVS007I September   1998  – June 2025 LM2674

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Recommended Operating Conditions
    4. 5.4  Thermal Information
    5. 5.5  Electrical Characteristics – 3.3-V Version
    6. 5.6  Electrical Characteristics – 5-V Version
    7. 5.7  Electrical Characteristics – 12-V Version
    8. 5.8  Electrical Characteristics – Adjustable Voltage Version
    9. 5.9  Electrical Characteristics – All Output Voltage Versions
    10. 5.10 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Adjustable Output Voltage
    4. 6.4 Device Functional Modes
      1. 6.4.1 Shutdown Mode
      2. 6.4.2 Active Mode
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Applications
      1. 7.2.1 Fixed Output Voltage Typical Application
        1. 7.2.1.1 Design Requirements
        2. 7.2.1.2 Detailed Design Procedure
          1. 7.2.1.2.1 Custom Design with WEBENCH® Tools
          2. 7.2.1.2.2 Inductor Selection (L1)
          3. 7.2.1.2.3 Output Capacitor Selection (COUT)
          4. 7.2.1.2.4 Catch Diode Selection (D1)
          5. 7.2.1.2.5 Input Capacitor (CIN)
          6. 7.2.1.2.6 Boost Capacitor (CB)
        3. 7.2.1.3 Application Curves
      2. 7.2.2 Adjustable Output Voltage Typical Application
        1. 7.2.2.1 Design Requirements
        2. 7.2.2.2 Detailed Design Procedure
          1. 7.2.2.2.1 Programming Output Voltage
          2. 7.2.2.2.2 Inductor Selection (L1)
          3. 7.2.2.2.3 Output Capacitor Selection (COUT)
          4. 7.2.2.2.4 Catch Diode Selection (D1)
          5. 7.2.2.2.5 Input Capacitor (CIN)
          6. 7.2.2.2.6 Boost Capacitor (CB)
        3. 7.2.2.3 Application Curves
      3. 7.2.3 Typical Application for All Output Voltage Versions
        1. 7.2.3.1 Application Curves
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
        1. 7.4.1.1 WSON Package Devices
      2. 7.4.2 Layout Examples
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Development Support
        1. 8.1.1.1 Custom Design with WEBENCH® Tools
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
    3. 8.3 Receiving Notification of Documentation Updates
    4. 8.4 Support Resources
    5. 8.5 Trademarks
    6. 8.6 Electrostatic Discharge Caution
    7. 8.7 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.4 Thermal Information

THERMAL METRIC(1)LM2674UNIT
D (SOIC)P (PDIP)NHN (WSON)
8 PINS8 PINS16 PINS
RθJAJunction-to-ambient thermal resistance(2)10595—°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application note.
(2) Junction to ambient thermal resistance with approximately 1 square inch of printed-circuit board copper surrounding the leads. Additional copper area lowers thermal resistance further. The value RθJA for the WSON (NHN) package is specifically dependent on PCB trace area, trace material, and the number of layers and thermal vias. For improved thermal resistance and power dissipation for the WSON package, see AN-1187 Leadless Leadframe Package (LLP) application note.