SNVS026O March   2000  – June 2016 LM2679

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specification
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics - 3.3 V
    6. 6.6  Electrical Characteristics - 5 V
    7. 6.7  Electrical Characteristics - 12 V
    8. 6.8  Electrical Characteristics - Adjustable
    9. 6.9  Electrical Characteristics - All Output Voltage Versions
    10. 6.10 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Switch Output
      2. 7.3.2 Input
      3. 7.3.3 C Boost
      4. 7.3.4 Ground
      5. 7.3.5 Current Adjust
      6. 7.3.6 Feedback
    4. 7.4 Device Functional Modes
      1. 7.4.1 Soft Start
  8. Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Design Considerations
      2. 8.1.2 Inductor
      3. 8.1.3 Output Capacitor
      4. 8.1.4 Input Capacitor
      5. 8.1.5 Catch Diode
      6. 8.1.6 Boost Capacitor
      7. 8.1.7 Adjustable Current Limit, RADJ
      8. 8.1.8 Soft-Start Capacitor, CSS
      9. 8.1.9 Additional Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Typical Application for All Output Voltage Versions
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Capacitor Selection Guides
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Fixed Output Voltage Design Example
        1. 8.2.2.1 Detailed Design Procedure
          1. 8.2.2.1.1 Capacitor Selection
      3. 8.2.3 Adjustable Output Design Example
        1. 8.2.3.1 Detailed Design Procedure
          1. 8.2.3.1.1 Capacitor Selection
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 VSON Package Devices

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

12 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

12.1 VSON Package Devices

The LM2679 is offered in the 14-lead VSON surface mount package to allow for a significantly decreased footprint with equivalent power dissipation compared to the DDPAK.

The Die Attach Pad (DAP) can and must be connected to PCB Ground plane or island. For CAD and assembly guidelines, refer to AN-1187 Leadless Leadfram Package (LLP).