SNVS556C April   2008  – January 2016 LM2738

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Boost Function
      2. 7.3.2 Soft-Start
      3. 7.3.3 Output Overvoltage Protection
      4. 7.3.4 Undervoltage Lockout
      5. 7.3.5 Current Limit
      6. 7.3.6 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Enable Pin and Shutdown Mode
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1  LM2738X Circuit Example 1
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Inductor Selection
          2. 8.2.1.2.2 Input Capacitor
          3. 8.2.1.2.3 Output Capacitor
          4. 8.2.1.2.4 Catch Diode
          5. 8.2.1.2.5 Output Voltage
          6. 8.2.1.2.6 Calculating Efficiency and Junction Temperature
        3. 8.2.1.3 Application Curve
      2. 8.2.2  LM2738X Circuit Example 2
        1. 8.2.2.1 Detailed Design Procedure
        2. 8.2.2.2 Application Curve
      3. 8.2.3  LM2738X Circuit Example 3
        1. 8.2.3.1 Detailed Design Procedure
        2. 8.2.3.2 Application Curve
      4. 8.2.4  LM2738X Circuit Example 4
        1. 8.2.4.1 Detailed Design Procedure
      5. 8.2.5  LM2738X Circuit Example 5
        1. 8.2.5.1 Detailed Design Procedure
      6. 8.2.6  LM2738Y Circuit Example 6
        1. 8.2.6.1 Detailed Design Procedure
        2. 8.2.6.2 Application Curve
      7. 8.2.7  LM2738Y Circuit Example 7
        1. 8.2.7.1 Detailed Design Procedure
        2. 8.2.7.2 Application Curve
      8. 8.2.8  LM2738Y Circuit Example 8
        1. 8.2.8.1 Detailed Design Procedure
        2. 8.2.8.2 Application Curve
      9. 8.2.9  LM2738Y Circuit Example 9
        1. 8.2.9.1 Detailed Design Procedure
        2. 8.2.9.2 Application Curve
      10. 8.2.10 LM2738Y Circuit Example 10
        1. 8.2.10.1 Detailed Design Procedure
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 WSON Package
    2. 10.2 Layout Example
    3. 10.3 Thermal Considerations
      1. 10.3.1 Silicon Junction Temperature Determination Methods
        1. 10.3.1.1 Method 1
        2. 10.3.1.2 Method 2
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from B Revision (April 2013) to C Revision

  • Added Device Information table, ESD Ratings table, Thermal Information table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information sectionGo

Changes from A Revision (April 2013) to B Revision

  • Changed layout of National Data Sheet to TI formatGo