SNVS561G September   2008  – September 2015 LM3150

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Typical Application Schematic
  5. 5 Revision History
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Ratings
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Programming the Output Voltage
      2. 8.3.2 Regulation Comparator
      3. 8.3.3 Overvoltage Comparator
      4. 8.3.4 Current Limit
      5. 8.3.5 Short-Circuit Protection
      6. 8.3.6 Soft-Start
      7. 8.3.7 Thermal Protection
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Custom Design with WEBENCH Tools
        2. 9.2.2.2 LM3150 Design Procedure
        3. 9.2.2.3 Design Guide
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Custom Design with WEBENCH Tools
      2. 12.1.2 Receiving Notification of Documentation Updates
      3. 12.1.3 Third-Party Products Disclaimer
      4. 12.1.4 Related Documentation
    2. 12.2 Community Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted) (1)(2)
MIN MAX UNIT
VIN, RON to GND –0.3 47 V
SW to GND –3 47 V
BST to SW –0.3 7 V
BST to GND –0.3 52 V
All Other Inputs to GND –0.3 7 V
Tstg Storage temperature –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Ratings. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and specifications.

7.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1) ±2000 V
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

7.3 Recommended Operating Ratings

over operating free-air temperature range (unless otherwise noted)
MIN NOM MAX UNIT
VIN 6 42 V
Junction Temperature Range (TJ) −40 125 °C
EN 0 5 V

7.4 Thermal Information

THERMAL METRIC(1) LM3150 UNIT
PWP
14 PINS
RθJA Junction-to-ambient thermal resistance 42.5 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 28.7
RθJB Junction-to-board thermal resistance 24.2
ψJT Junction-to-top characterization parameter 0.9
ψJB Junction-to-board characterization parameter 23.9
RθJC(bot) Junction-to-case (bottom) thermal resistance 4.4
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

7.5 Electrical Characteristics

over operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS TJ = 25°C TJ = -40°C to 125°C UNIT
MIN TYP MAX MIN TYP MAX
START-UP; REGULATOR, VCC
VCC CVCC = 1 µF, 0 mA to 40 mA 5.95 5.65 6.25 V
VIN - VCC VIN - VCC Dropout Voltage IVCC = 2 mA, VIN = 5.5 V 40 mV
IVCC = 30 mA, VIN = 5.5 V 330
IVCCL VCC Current Limit(1) VCC = 0V 100 65 mA
VCCUVLO VCC Undervoltage Lockout Threshold (UVLO) VCC Increasing 5.1 4.75 5.40 V
VCCUVLO-HYS VCC UVLO Hysteresis VCC Decreasing 475 mV
tCC-UVLO-D VCC UVLO Filter Delay 3 µs
IIN Input Operating Current No Switching, VFB = 1 V 3.5 5 mA
IIN-SD Input Operating Current, Device Shutdown VEN = 0 V 32 55 µA
GATE DRIVE
IQ-BST Boost Pin Leakage VBST – VSW = 6 V 2 nA
RDS-HG-Pull-Up HG Drive Pullip On-Resistance IHG Source = 200 mA 5 Ω
RDS-HG-Pull-Down HG Drive Pulldown On-Resistance IHG Sink = 200 mA 3.4 Ω
RDS-LG-Pull-Up LG Drive Pullup On-Resistance ILG Source = 200 mA 3.4 Ω
RDS-LG-Pull-Down LG Drive Pulldown On-Resistance ILG Sink = 200 mA 2 Ω
SOFT-START
ISS SS Pin Source Current VSS = 0 V 7.7 5.9 9.5 µA
ISS-DIS SS Pin Discharge Current Current Limit 200 µA
ILIM-TH Current Limit Sense Pin Source Current 75 85 95 µA
ON/OFF TIMER
tON ON Timer Pulse Width VIN = 10V, RON = 100 kΩ,
VFB = 0.6V		 1.02 µs
VIN = 18V, RON = 100 kΩ,
VFB = 0.6 V		 0.62
VIN = 42 V, RON = 100 kΩ,
VFB = 0.6 V		 0.36
tON-MIN ON Timer Minimum Pulse Width See(2) 200 ns
tOFF OFF Timer Minimum Pulse Width 370 525 ns
ENABLE INPUT
VEN EN Pin Input Threshold Trip Point VEN Rising 1.20 1.14 1.26 V
VEN-HYS EN Pin Threshold Hysteresis VEN Falling 120 mV
REGULATION AND OVERVOLTAGE COMPARATOR
VFB In-Regulation Feedback Voltage VSS > 0.6 V 0.600 0.588 0.612 V
VFB-OV Feedback Overvoltage Threshold 0.720 0.690 0.748 V
IFB Feedback Bias Current 20 nA
BOOST DIODE
Vf Forward Voltage IBST = 2 mA 0.7 V
IBST = 30 mA 1
THERMAL CHARACTERISTICS
TSD Thermal Shutdown Rising 165 °C
Thermal Shutdown Hysteresis Falling 15 °C
(1) VCC provides self bias for the internal gate drive and control circuits. Device thermal limitations limit external loading.
(2) See Detailed Description section for minimum on-time when using MOSFETs connected to gate drivers.

7.6 Typical Characteristics

LM3150 30079608.png
Figure 1. 500-kHz Full Load Transient
LM3150 30053140.png
Figure 3. Boost Diode Forward Voltage vs Temperature
LM3150 30053142.png
Figure 5. Quiescent Current vs Temperature
LM3150 30053144.png
Figure 7. tON vs Temperature
LM3150 30053146.png
Figure 9. tON vs Temperature
LM3150 30053148.png
Figure 11. VCC Dropout vs Temperature
LM3150 30079610.png
Figure 2. 500-kHz Partial Load Transient
LM3150 30053141.png
Figure 4. ILIM-TH vs Temperature
LM3150 30053143.png
Figure 6. Soft-Start Current vs Temperature
LM3150 30053145.png
Figure 8. tON vs Temperature
LM3150 30053147.png
Figure 10. VCC Current Limit vs Temperature
LM3150 30053149.png
Figure 12. VCC vs Temperature