SNVSAY0 June   2017 LM317-N-MIL

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Load Regulation
    4. 7.4 Device Functional Modes
      1. 7.4.1 External Capacitors
      2. 7.4.2 Protection Diodes
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1  1.25-V to 25-V Adjustable Regulator
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curve
      2. 8.2.2  5-V Logic Regulator With Electronic Shutdown
      3. 8.2.3  Slow Turnon 15-V Regulator
      4. 8.2.4  Adjustable Regulator With Improved Ripple Rejection
      5. 8.2.5  High Stability 10-V Regulator
      6. 8.2.6  High-Current Adjustable Regulator
      7. 8.2.7  Emitter-Follower Current Amplifier
      8. 8.2.8  1-A Current Regulator
      9. 8.2.9  Common-Emitter Amplifier
      10. 8.2.10 Low-Cost 3-A Switching Regulator
      11. 8.2.11 Current-Limited Voltage Regulator
      12. 8.2.12 Adjusting Multiple On-Card Regulators With Single Control
      13. 8.2.13 AC Voltage Regulator
      14. 8.2.14 12-V Battery Charger
      15. 8.2.15 Adjustable 4-A Regulator
      16. 8.2.16 Current-Limited 6-V Charger
      17. 8.2.17 Digitally Selected Outputs
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Thermal Considerations
      1. 10.3.1 Heatsink Requirements
      2. 10.3.2 Heatsinking Surface Mount Packages
        1. 10.3.2.1 Heatsinking the SOT-223 (DCY) Package
        2. 10.3.2.2 Heatsinking the TO-263 (KTT) Package
        3. 10.3.2.3 Heatsinking the TO-252 (NDP) Package
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Related Links
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)(2)
MIN MAX UNIT
Power dissipation Internally Limited
Input-output voltage differential −0.3 40 V
Lead temperature Metal package (soldering, 10 seconds) 300 °C
Plastic package (soldering, 4 seconds) 260 °C
Storage temperature, Tstg −65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and specifications.

6.2 ESD Ratings

VALUE UNIT
V(ESD) Electrostatic discharge Human-body model (HBM)(1) ±3000 V
(1) Manufacturing with less than 500-V HBM is possible with the necessary precautions. Pins listed as ±3000 V may actually have higher performance.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
Operating temperature (LM117) −55 150 °C
Operating temperature (LM317-N) 0 125 °C

6.4 Thermal Information

THERMAL METRIC(1)(2) LM317-N UNIT
KTT
(TO-263)		 NDE
(TO-220)		 DCY
(SOT-223)		 NDT
(TO)		 NDP
(TO-252)
3 PINS 3 PINS 4 PINS 3 PINS 3 PINS
RθJA Junction-to-ambient thermal resistance 41.0 23.3 59.6 186(3) 54 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 43.6 16.2 39.3 21 51.3 °C/W
RθJB Junction-to-board thermal resistance 23.6 4.9 8.4 — 28.6 °C/W
ψJT Junction-to-top characterization parameter 10.4 2.7 1.8 — 3.9 °C/W
ψJB Junction-to-board characterization parameter 22.6 4.9 8.3 — 28.1 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 0.9 1.1 — — 0.9 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.
(2) When surface mount packages are used (SOT-223, TO-252), the junction to ambient thermal resistance can be reduced by increasing the PCB copper area that is thermally connected to the package. See Heatsink Requirements for heatsink techniques.
(3) No heatsink

6.5 Electrical Characteristics(1)

Some specifications apply over full Operating Temperature Range as noted. Unless otherwise specified, TJ = 25°C, VIN − VOUT = 5 V, and IOUT = 10 mA.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
Reference voltage TJ = 25°C 1.25 V
3 V ≤ (VIN − VOUT) ≤ 40 V,
10 mA ≤ IOUT ≤ IMAX(1) (over Full Operating Temperature Range)		 1.2 1.25 1.3 V
Line regulation 3V ≤ (VIN − VOUT) ≤ 40 V(2) TJ = 25°C 0.01 0.04 %/V
(over full operating temperature range) 0.02 0.07
Load regulation 10 mA ≤ IOUT ≤ IMAX(1)(2) TJ = 25°C 0.1% 0.5%
(over full operating temperature range) 0.3% 1.5%
Thermal regulation 20-ms pulse 0.04 0.07 %/W
Adjustment pin current (over full operating temperature range) 50 100 μA
Adjustment pin current change 10 mA ≤ IOUT ≤ IMAX(1)
3V ≤ (VIN − VOUT) ≤ 40V		 (over full operating temperature range) 0.2 5 μA
Temperature stability TMIN ≤ TJ ≤ TMAX (over full operating temperature range) 1%
Minimum load current (VIN − VOUT) = 40 V (over full operating temperature range) 3.5 10 mA
Current limit (VIN − VOUT) ≤ 15 V  TO-3, TO-263 Packages (over full operating temperature range) 1.5 2.2 3.4 A
SOT-223, TO-220 Packages (over full operating temperature range) 1.5 2.2 3.4
TO, TO-252 Package (over full operating temperature range) 0.5 0.8 1.8
(VIN − VOUT) = 40 V TO-3, TO-263 packages 0.15 0.4 A
SOT-223, TO-220 packages 0.15 0.4
TO, TO-252 package 0.075 0.2
RMS output noise, % of VOUT 10 Hz ≤ f ≤ 10 kHz 0.003%
Ripple rejection ratio VOUT = 10 V, f = 120 Hz, CADJ = 0 μF (over full operating temperature range) 65 dB
VOUT = 10V, f = 120 Hz, CADJ = 10 μF (over full operating temperature range) 66 80 dB
Long-term stability TJ = 125°C, 1000 hrs 0.3% 1%
(1) IMAX = 1.5 A for the NDS (TO-3), NDE (TO-220), and KTT (TO-263) packages. IMAX = 1.0 A for the DCY (SOT-223) package.
IMAX = 0.5 A for the NDT (TO) and NDP (TO-252) packages. Device power dissipation (PD) is limited by ambient temperature (TA), device maximum junction temperature (TJ), and package thermal resistance (θJA). The maximum allowable power dissipation at any temperature is : PD(MAX) = ((TJ(MAX) – TA) / θJA). All Min. and Max. limits are ensured to TI's Average Outgoing Quality Level (AOQL).
(2) Regulation is measured at a constant junction temperature, using pulse testing with a low duty cycle. Changes in output voltage due to heating effects are covered under the specifications for thermal regulation.

6.6 Typical Characteristics

Output Capacitor = 0 μF, unless otherwise noted.
LM317-N-MIL 906337.gif
Figure 1. Load Regulation
LM317-N-MIL 906339.gif
Figure 3. Adjustment Current
LM317-N-MIL 906367.gif
Figure 5. VOUT vs VIN, VOUT = VREF
LM317-N-MIL 906341.gif
Figure 7. Temperature Stability
LM317-N-MIL 906343.gif
Figure 9. Ripple Rejection
LM317-N-MIL 906345.gif
Figure 11. Ripple Rejection
LM317-N-MIL 906347.gif
Figure 13. Line Transient Response
LM317-N-MIL 906338.gif
Figure 2. Current Limit
LM317-N-MIL 906340.gif
Figure 4. Dropout Voltage
LM317-N-MIL 906368.gif
Figure 6. VOUT vs VIN, VOUT = 5 V
LM317-N-MIL 906342.gif
Figure 8. Minimum Operating Current
LM317-N-MIL 906344.gif
Figure 10. Ripple Rejection
LM317-N-MIL 906346.gif
Figure 12. Output Impedance
LM317-N-MIL 906348.gif
Figure 14. Load Transient Response