SNIS161D March   2000  – January  2016 LM34


  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics: LM34A and LM34CA
    6. 6.6 Electrical Characteristics: LM34, LM34C, and LM34D
    7. 6.7 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Capacitive Drive Capability
      2. 7.3.2 LM34 Transfer Function
    4. 7.4 Device Functional Modes
  8. Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Basic Fahrenheit Temperature Sensor Application
        1. Design Requirements
        2. Detailed Design Procedure
        3. Application Curve
    3. 8.3 System Examples
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Trademarks
    2. 11.2 Electrostatic Discharge Caution
    3. 11.3 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10 Layout

10.1 Layout Guidelines

The LM34 device can be easily applied in the same way as other integrated-circuit temperature sensors. The device can be glued or cemented to a surface and its temperature will be within about 0.02°F of the surface temperature. This presumes that the ambient air temperature is almost the same as the surface temperature; if the air temperature were much higher or lower than the surface temperature, the actual temperature of the LM34 die would be at an intermediate temperature between the surface temperature and the air temperature. This is especially true for the TO-92 plastic package, where the copper leads are the principal thermal path to carry heat into the device, so its temperature might be closer to the air temperature than to the surface temperature.

To minimize this problem, be sure that the wiring to the LM34, as it leaves the device, is held at the same temperature as the surface of interest. The easiest way to do this is to cover up these wires with a bead of epoxy, which will insure that the leads and wires are all at the same temperature as the surface, and that the die temperature of the LM34 device will not be affected by the air temperature.

The TO-46 metal package can be soldered to a metal surface or pipe without damage. In the case where soldering is used, the V− terminal of the circuit will be grounded to that metal. Alternatively, the LM34 device can be mounted inside a sealed-end metal tube, and can then be dipped into a bath or screwed into a threaded hole in a tank. As with any IC, the LM34 and accompanying wiring and circuits must be kept insulated and dry, to avoid leakage and corrosion. This is especially true if the circuit may operate at cold temperatures where condensation can occur. Printed-circuit coatings and varnishes such as a conformal coating and epoxy paints or dips are often used to insure that moisture cannot corrode the LM34 or its connections.

These devices are sometimes soldered to a small, light-weight heat fin to decrease the thermal time constant and speed up the response in slowly-moving air. On the other hand, a small thermal mass may be added to the sensor to give the steadiest reading despite small deviations in the air temperature.

Table 2. Temperature Rise of LM34 Due to Self-Heating (Thermal Resistance)

Still air 720°F/W 180°F/W 324°F/W 252°F/W 400°F/W 200°F/W
Moving air 180°F/W 72°F/W 162°F/W 126°F/W 190°F/W 160°F/W
Still oil 180°F/W 72°F/W 162°F/W 126°F/W
Stirred oil 90°F/W 54°F/W 81°F/W 72°F/W
(Clamped to metal, infinite heart sink) (43°F/W ) (95°F/W )
(1) Wakefield type 201 or 1-inch disc of 0.020-inch sheet brass, soldered to case, or similar.
(2) TO-92 and SO-8 packages glued and leads soldered to 1-inch square of 1/16 inches printed circuit board with 2 oz copper foil, or similar.

10.2 Layout Example

LM34 Layout_SNIS161.gif Figure 28. Layout Example