SNIS159H August   1999  – December 2017 LM35


  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics: LM35A, LM35CA Limits
    6. 6.6 Electrical Characteristics: LM35A, LM35CA
    7. 6.7 Electrical Characteristics: LM35, LM35C, LM35D Limits
    8. 6.8 Electrical Characteristics: LM35, LM35C, LM35D
    9. 6.9 Typical Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 LM35 Transfer Function
    4. 7.4 Device Functional Modes
  8. Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Capacitive Drive Capability
    2. 8.2 Typical Application
      1. 8.2.1 Basic Centigrade Temperature Sensor
        1. Design Requirements
        2. Detailed Design Procedure
        3. Application Curve
    3. 8.3 System Examples
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Receiving Notification of Documentation Updates
    2. 11.2 Community Resources
    3. 11.3 Trademarks
    4. 11.4 Electrostatic Discharge Caution
    5. 11.5 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • D|8
  • NDV|3
  • LP|3
  • NEB|3
Thermal pad, mechanical data (Package|Pins)
Orderable Information


Layout Guidelines

The LM35 is easily applied in the same way as other integrated-circuit temperature sensors. Glue or cement the device to a surface and the temperature should be within about 0.01°C of the surface temperature.

The 0.01°C proximity presumes that the ambient air temperature is almost the same as the surface temperature. If the air temperature were much higher or lower than the surface temperature, the actual temperature of the LM35 die would be at an intermediate temperature between the surface temperature and the air temperature; this is especially true for the TO-92 plastic package. The copper leads in the TO-92 package are the principal thermal path to carry heat into the device, so its temperature might be closer to the air temperature than to the surface temperature.

Ensure that the wiring leaving the LM35 device is held at the same temperature as the surface of interest to minimize the temperature problem. The easiest fix is to cover up these wires with a bead of epoxy. The epoxy bead will ensure that the leads and wires are all at the same temperature as the surface, and that the temperature of the LM35 die is not affected by the air temperature.

The TO-46 metal package can also be soldered to a metal surface or pipe without damage. Of course, in that case the V− terminal of the circuit will be grounded to that metal. Alternatively, mount the LM35 inside a sealed-end metal tube, and then dip into a bath or screw into a threaded hole in a tank. As with any IC, the LM35 device and accompanying wiring and circuits must be kept insulated and dry, to avoid leakage and corrosion. This is especially true if the circuit may operate at cold temperatures where condensation can occur. Printed-circuit coatings and varnishes such as a conformal coating and epoxy paints or dips are often used to insure that moisture cannot corrode the LM35 device or its connections.

These devices are sometimes soldered to a small light-weight heat fin to decrease the thermal time constant and speed up the response in slowly-moving air. On the other hand, a small thermal mass may be added to the sensor, to give the steadiest reading despite small deviations in the air temperature.

Table 2. Temperature Rise of LM35 Due To Self-heating (Thermal Resistance, RθJA)

TO, no heat sink TO(1), small heat fin TO-92, no heat sink TO-92(2), small heat fin SOIC-8, no heat sink SOIC-8(2), small heat fin TO-220, no heat sink
Still air 400°C/W 100°C/W 180°C/W 140°C/W 220°C/W 110°C/W 90°C/W
Moving air 100°C/W 40°C/W 90°C/W 70°C/W 105°C/W 90°C/W 26°C/W
Still oil 100°C/W 40°C/W 90°C/W 70°C/W
Stirred oil 50°C/W 30°C/W 45°C/W 40°C/W
(Clamped to metal, Infinite heat sink) (24°C/W) (55°C/W)
Wakefield type 201, or 1-in disc of 0.02-in sheet brass, soldered to case, or similar.
TO-92 and SOIC-8 packages glued and leads soldered to 1-in square of 1/16-in printed circuit board with 2-oz foil or similar.

Layout Example

LM35 Layout_SNIS159.gif Figure 28. Layout Example