SNVS624B June   2011  – June 2016 LM3559

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 I2C Timing Requirements (SCL, SDA)
  7. 7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1  Power Amplifier Synchronization (TX1)
      2. 8.3.2  Input Voltage Flash Monitor Fault
      3. 8.3.3  Independent LED Control
      4. 8.3.4  Hardware Torch
      5. 8.3.5  Fault Protections
        1. 8.3.5.1 Overvoltage Protection
        2. 8.3.5.2 Current Limit
        3. 8.3.5.3 Flash Timeout
        4. 8.3.5.4 Indicator LED/Thermistor (LEDI/NTC)
          1. 8.3.5.4.1 Message Indicator Current Source (LEDI/NTC)
            1. 8.3.5.4.1.1 Message Indicator Example 1 (Single Pulse With Dead Time):
            2. 8.3.5.4.1.2 Message Indicator Example 2 (Multiple Pulses With Dead Time):
            3. 8.3.5.4.1.3 Updating The Message Indicator
      6. 8.3.6  Input Voltage (VIN ) Monitor
      7. 8.3.7  VIN Flash Monitor (Flash Current Rising)
      8. 8.3.8  Last Flash Register
      9. 8.3.9  LED Voltage Monitor
      10. 8.3.10 ADC Delay
      11. 8.3.11 Flags Register and Fault Indicators
        1. 8.3.11.1 Flash Timeout
        2. 8.3.11.2 Thermal Shutdown
        3. 8.3.11.3 LED Fault
        4. 8.3.11.4 TX1 and TX2 Interrupt Flags
        5. 8.3.11.5 LED Thermal Fault (NTC Flag)
        6. 8.3.11.6 Input Voltage Monitor Fault
    4. 8.4 Device Functional Modes
      1. 8.4.1  Start-Up (Enabling the Device)
      2. 8.4.2  Pass Mode
      3. 8.4.3  Flash Mode
      4. 8.4.4  Torch Mode
      5. 8.4.5  Privacy-Indicate Mode
      6. 8.4.6  GPIO1 Mode
      7. 8.4.7  TX2/INT/GPIO2
      8. 8.4.8  TX2 Mode
        1. 8.4.8.1 TX2 Shutdown
      9. 8.4.9  GPIO2 Mode
      10. 8.4.10 Interrupt Output (INT Mode)
      11. 8.4.11 NTC Mode
      12. 8.4.12 Alternate External Torch (AET Mode)
      13. 8.4.13 Automatic Conversion Mode
      14. 8.4.14 Manual Conversion Mode
    5. 8.5 Programming
      1. 8.5.1 I2C-Compatible Interface
        1. 8.5.1.1 START and STOP Conditions
        2. 8.5.1.2 I2C-Compatible Chip Address
        3. 8.5.1.3 Transferring Data
    6. 8.6 Register Maps
      1. 8.6.1  Enable Register
      2. 8.6.2  Torch Brightness Register
      3. 8.6.3  Flash Brightness Register
      4. 8.6.4  Flash Duration Register
      5. 8.6.5  Flags Register
      6. 8.6.6  Configuration Register 1
      7. 8.6.7  Configuration Register 2
      8. 8.6.8  GPIO Register
      9. 8.6.9  Last Flash Register
      10. 8.6.10 VLED Monitor Register
      11. 8.6.11 ADC Delay Register
      12. 8.6.12 Input Voltage Monitor Register
      13. 8.6.13 Privacy Register
      14. 8.6.14 Privacy PWM Period Register
      15. 8.6.15 Indicator Register
      16. 8.6.16 Indicator Blinking Register
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 LM3559 Typical Application
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
          1. 9.2.1.2.1 Output Capacitor Selection
          2. 9.2.1.2.2 Input Capacitor Selection
          3. 9.2.1.2.3 Inductor Selection
        3. 9.2.1.3 Application Curves
      2. 9.2.2 LM3559 Typical Application Circuit With Thermistor
        1. 9.2.2.1 Detailed Design Procedure
          1. 9.2.2.1.1 NTC Thermistor Selection
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Third-Party Products Disclaimer
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 Community Resources
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

12 Device and Documentation Support

12.1 Device Support

12.1.1 Third-Party Products Disclaimer

TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.

12.2 Documentation Support

12.2.1 Related Documentation

For additional information, see the following:

12.3 Receiving Notification of Documentation Updates

To receive notification of documentation updates — go to the product folder for your device on ti.com. In the upper right-hand corner, click the Alert me button to register and receive a weekly digest of product information that has changed (if any). For change details, check the revision history of any revised document.

12.4 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

12.5 Trademarks

E2E is a trademark of Texas Instruments.

All other trademarks are the property of their respective owners.

12.6 Electrostatic Discharge Caution

esds-image

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

12.7 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.