4 Revision History
Changes from B Revision (August 2013) to C Revision
-
Added Device Information and Pin Configuration and Functions sections, ESD Ratings and Thermal Information tables, Feature Description, Device Functional Modes, Application and Implementation, Power Supply Recommendations, Layout, Device and Documentation Support, and Mechanical, Packaging, and Orderable Information sectionsGo
-
Deleted Maximum Lead Temperature row per new TI data sheet standards Go
-
Changed RθJA from "50.4°C/W" to "71.4°C/W"; add additional thermal valuesGo