SNVSA63A April   2015  – September 2015 LM3632A

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 I2C Timing Requirements (SDA, SCL)
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Features Description
      1. 7.3.1 Backlight
        1. 7.3.1.1 Brightness Control
          1. 7.3.1.1.1 LED Current with PWM Disabled
          2. 7.3.1.1.2 LED Current with PWM Enabled
        2. 7.3.1.2 Sloper
        3. 7.3.1.3 Mapper
        4. 7.3.1.4 PWM Input
        5. 7.3.1.5 PWM Minimum On/Off Time
        6. 7.3.1.6 PWM Resolution and Input Frequency Range
        7. 7.3.1.7 PWM Hysteresis
        8. 7.3.1.8 PWM Timeout
        9. 7.3.1.9 Backlight Boost Converter
          1. 7.3.1.9.1 Headroom Voltage
          2. 7.3.1.9.2 Backlight Protection and Faults
            1. 7.3.1.9.2.1 Overvoltage Protection (OVP) and Open-Load Fault Protection
            2. 7.3.1.9.2.2 Overcurrent Protection (OCP) and Overcurrent Protection Flag
      2. 7.3.2 LCM Bias
        1. 7.3.2.1 Display Bias Boost Converter (VVPOS, VVNEG)
        2. 7.3.2.2 Auto Sequence Mode
        3. 7.3.2.3 Wake-up Mode
        4. 7.3.2.4 Active Discharge
        5. 7.3.2.5 LCM Bias Protection and Faults
          1. 7.3.2.5.1 LCM Overvoltage Protection
          2. 7.3.2.5.2 VNEG Overvoltage Protection
          3. 7.3.2.5.3 VPOS Short Circuit Protection
          4. 7.3.2.5.4 VNEG Short Circuit Protection
      3. 7.3.3 Flash
        1. 7.3.3.1 Flash Boost Converter
        2. 7.3.3.2 Start-Up (Enabling The Device)
        3. 7.3.3.3 Pass Mode
        4. 7.3.3.4 Flash Mode
        5. 7.3.3.5 Torch Mode
        6. 7.3.3.6 Power Amplifier Synchronization (TX)
        7. 7.3.3.7 VIN Monitor
        8. 7.3.3.8 Flash Fault Protections
          1. 7.3.3.8.1 Fault Operation
          2. 7.3.3.8.2 Flash Time-Out
          3. 7.3.3.8.3 Overvoltage Protection (OVP)
          4. 7.3.3.8.4 Current Limit
          5. 7.3.3.8.5 FLED and/or FL_OUT Short Fault
      4. 7.3.4 Software RESET
      5. 7.3.5 EN Input
      6. 7.3.6 Thermal Shutdown (TSD)
    4. 7.4 Device Functional Modes
      1. 7.4.1 Modes of Operation
    5. 7.5 Programming
      1. 7.5.1 I2C-Compatible Serial Bus Interface
        1. 7.5.1.1 Interface Bus Overview
        2. 7.5.1.2 Data Transactions
        3. 7.5.1.3 Acknowledge Cycle
        4. 7.5.1.4 Acknowledge After Every Byte Rule
        5. 7.5.1.5 Addressing Transfer Formats
    6. 7.6 Register Maps
      1. 7.6.1  Revision (Address = 0x01) [reset = 0x09]
      2. 7.6.2  Backlight Configuration1 (Address = 0x02) [reset = 0x30]
      3. 7.6.3  Backlight Configuration2 (Address = 0x03) [reset = 0x0D]
      4. 7.6.4  Backlight Brightness LSB (Address = 0x04) [reset = 0x07]
      5. 7.6.5  Backlight Brightness MSB (Address = 0x05) [reset = 0xFF]
      6. 7.6.6  Flash/Torch Current (Address = 0x06) [reset = 0x3E]
      7. 7.6.7  Flash Configuration (Address = 0x07) [reset = 0x2F]
      8. 7.6.8  VIN Monitor (Address = 0x08) [reset = 0x03]
      9. 7.6.9  I/O Control (Address = 0x09) [reset = 0x00]
      10. 7.6.10 Enable (Address = 0x0A) [reset = 0x00]
      11. 7.6.11 Flags1 (Address = 0x0B) [reset = 0x00]
      12. 7.6.12 Display Bias Configuration (Address = 0x0C) [reset = 0x18]
      13. 7.6.13 LCM Boost Bias (Address = 0x0D) [reset = 0x1E]
      14. 7.6.14 VPOS Bias (Address = 0x0E) [reset = 0x1E]
      15. 7.6.15 VNEG Bias (Address = 0x0F) [reset = 0x1C]
      16. 7.6.16 Flags2 (Address = 0x10) [reset = 0x00]
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 External Components
        2. 8.2.2.2 Inductor Selection
        3. 8.2.2.3 Boost Output Capacitor Selection
        4. 8.2.2.4 Input Capacitor Selection
      3. 8.2.3 Application Curves
        1. 8.2.3.1 Backlight Curves
        2. 8.2.3.2 LCM Bias Curves
        3. 8.2.3.3 Flash Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11 Device and Documentation Support

11.1 Device Support

11.1.1 Third-Party Products Disclaimer

TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.

11.2 Documentation Support

11.2.1 Related Documentation

For related documentation, see the following:

Texas Instruments Application Note AN1112: DSBGA Wafer Level Chip Scale Package (SNVA009).

Understanding Boost Power Stages in Switch Mode Power Supplies,

http://focus.ti.com/lit/an/slva061/slva061.pdf.

Power Stage Designer™ Tools, http://www.ti.com/tool/powerstage-designer.

11.3 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use.

    TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers.
    Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.

11.4 Trademarks

E2E is a trademark of Texas Instruments.

All other trademarks are the property of their respective owners.

11.5 Electrostatic Discharge Caution

esds-image

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

11.6 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.