SNVS821A January   2014  – March 2014 LM3699

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Terminal Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 Handling Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 PWM Input
        1. 7.3.1.1 PWM Input Frequency Range
        2. 7.3.1.2 PWM Low Detect
      2. 7.3.2 HWEN Input
      3. 7.3.3 Current Select Inputs (IS1 And IS0)
      4. 7.3.4 ILOW Input
      5. 7.3.5 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Operation with an Unused Current Sink
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Step-by-Step Design Procedure
        2. 8.2.2.2 Maximum Output Power
          1. 8.2.2.2.1 Peak Current Limited
          2. 8.2.2.2.2 Output Voltage Limited
        3. 8.2.2.3 Boost Inductor Selection
        4. 8.2.2.4 Output Capacitor Selection
        5. 8.2.2.5 Schottky Diode Selection
        6. 8.2.2.6 Input Capacitor Selection
      3. 8.2.3 Application Performance Plots
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Boost Output Capacitor Placement
      2. 10.1.2 Schottky Diode Placement
      3. 10.1.3 Inductor Placement
      4. 10.1.4 Boost Input Capacitor Placement
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 Trademarks
    3. 11.3 Electrostatic Discharge Caution
    4. 11.4 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted) (1)(2)
MIN MAX UNIT
VIN to GND −0.3V 6 V
VSW, VOVP, VHVLED1, VHVLED2, VHVLED3 to GND −0.3V 45
VIS1, VIS0, VILOW, VPWM to GND −0.3V 6
VHWEN to GND −0.3V 6
Continuous power dissipation Internally Limited
Maximum lead temperature (soldering) 260 (peak) °C
Junction temperature (TJ-MAX) 150
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages are with respect to the potential at the GND terminal.

6.2 Handling Ratings

MIN MAX UNIT
Storage temperature range −65 150 °C
ESD Ratings(1) Human body model (HBM)(2) 2.0 kV
Charged device model (CDM)(3) 1500 V
(1) Electrostatic discharge (ESD) to measure device sensitivity and immunity to damage caused by assembly line electrostatic discharges in to the device.
(2) Level listed above is the passing level per ANSI, ESDA, and JEDEC JS-001. JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(3) Level listed above is the passing level per EIA-JEDEC JESD22-C101. JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
VIN to GND 2.7 5.5 V
VSW, VOVP, VHVLED1, VVHLED2, VVHLED3 to GND 0 24
Junction temperature (TJ) (1)(2) −40 125 °C
(1) Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at TJ= 140°C (typ) and disengages at TJ = 125°C (typ).
(2) In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may have to be derated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP = 125°C), the maximum power dissipation of the device in the application (PD-MAX), and the junction-to ambient thermal resistance of the part/package in the application (θJA), as given by the following equation: TA-MAX = TJ-MAX-OP – (θJA × PD-MAX).

6.4 Thermal Information

THERMAL METRIC(1) DSBGA UNIT
(12 TERMINALS)
RθJA Junction-to-ambient thermal resistance 55 °C/W
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

6.5 Electrical Characteristics

Limits apply over the full operating ambient temperature range (−40°C ≤ TA ≤ 85°C) and VIN = 3.6V, unless otherwise specified.(1)(2)
SYMBOL PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
General
ISHDN Shutdown current 2.7 V ≤ VIN ≤ 5.5 V, HWEN = GND 3.0 µA
2.7 V ≤ VIN ≤ 5.5 V, HWEN = GND,
TA = 25°C		 1
TSD Thermal shutdown 140 °C
Hysteresis 15
Boost Converter
IHVLED(1/2/3) Output current regulation (HVLED1, HVLED2, HVLED3) 2.7 V ≤ VIN ≤ 5.5 V, ILOW = GND, IS0 = IS1 = VIN,
PWM Duty Cycle = 100%		 18.38 22.02 mA
2.7 V ≤ VIN ≤ 5.5 V, ILOW = GND, IS0 = IS1 = VIN,
PWM Duty Cycle = 100%
TA = 25°C		 20.2
ILOW = GND, IS0 = IS1 = VIN,
PWM Duty Cycle = 100%
TA = 25°C		 18.7 21.58
ILOW = GND, IS0 = IS1 = VIN,
PWM Duty Cycle = 100%,
TA = 25°C		 20.2
3.0 V ≤ VIN ≤ 4.5 V, ILOW = GND, IS0 = IS1 = VIN,
PWM Duty Cycle = 100%
TA = 25°C		 18.63 21.58
3.0 V ≤ VIN ≤ 4.5 V, ILOW = GND, IS0 = IS1 = VIN,
PWM Duty Cycle = 100%
TA = 25°C		 20.2
IMATCH_HV HVLED matching
(HVLED1 to HVLED2 or HVLED2 to HVLED3 or HVLED1 to HVLED3) (3)		 2.7 V ≤ VIN ≤ 5.5 V, ILOW = GND, IS0 = IS1 = VIN,
PWM Duty Cycle = 100%		 –2.5% 2.5%
ILOW = GND, IS0 = IS1 = VIN,
PWM Duty Cycle = 100%, TA = 25°C		 –2% 1.7%
3.0 V ≤ VIN ≤ 4.5 V, ILOW = GND, IS0 = IS1 = VIN,
PWM Duty Cycle = 100%		 –2.5% 2.5%
VREG_CS Regulated current sink headroom voltage ILOW = GND, IS0 = IS1 = VIN, PWM Duty Cycle = 100%,
TA = 25°C		 400 mV
VHR_MIN Minimum current sink headroom voltage for HVLED current sinks ILED = 95% of nominal, ILOW = GND, IS0 = IS1 = VIN, PWM Duty Cycle = 100% 275
ILED = 95% of nominal, ILOW = GND, IS0 = IS1 = VIN, PWM Duty Cycle = 100%
TA = 25°C		 190
RDSON NMOS switch on resistance ISW = 500 mA, TA = 25°C 0.3 Ω
ICL_BOOST NMOS Switch Current Limit 880 1120 mA
TA = 25°C 1000
VOVP Output overvoltage protection ON threshold, 2.7 V ≤ VIN ≤ 5.5 V 23 25 V
ON threshold, TA = 25°C 24
Hysteresis, TA = 25°C 0.7
fSW Switching frequency 2.7 V ≤ VIN ≤ 5.5 V 900 1100 kHz
TA = 25°C 1000
DMAX Maximum duty cycle TA = 25°C 94%
HWEN Input
VHWEN Input logic low 2.7 V ≤ VIN ≤ 5.5 V 0 0.4 V
Input logic high 2.7 V ≤ VIN ≤ 5.5 V 1.2 VIN
PWM Input
VPWM_L Input logic low 2.7 V ≤ VIN ≤ 5.5 V 0 0.4 V
VPWM_H Input logic high 2.7 V ≤ VIN ≤ 5.5 V 1.31 VIN
tPWM Minimum PWM input pulse detected 2.7 V ≤ VIN ≤ 5.5 V 0.75 µs
IS1, IS0, ILOW Inputs
VIL Input logic low 2.7 V ≤ VIN ≤ 5.5 V 0 0.4 V
VIH Input logic high 2.7 V ≤ VIN ≤ 5.5 V 1.29 VIN
Internal POR Threshold
VPOR POR reset release voltage threshold VIN ramp time = 100 μs 1.7 2.1 V
VIN ramp time = 100 μs
TA = 25°C		 1.9
(1) All voltages are with respect to the potential at the GND terminal.
(2) Minimum (Min) and Maximum (Max) limits are verified by design, test, or statistical analysis. Typical (Typ) numbers are not verified, but do represent the most likely norm. Unless otherwise specified, conditions for typical specifications are: VIN = 3.6 V and TA = 25°C.
(3) LED current sink matching in the high-voltage current sinks (HVLED1, HVLED2, and HVLED3) is given as the maximum matching value between any two current sinks, where the matching between any two high-voltage current sinks (X and Y) is given as (IHVLEDX (or IHVLEDY) - IAVE(X-Y))/(IAVE(X-Y)) x 100.

6.6 Typical Characteristics

C022_SNVS821.png
Figure 1. Rdson vs Temperature
C027_SNVS821.png
Figure 3. VHR_MIN vs Temperature
C025_SNVS821.pngFigure 5. PWM VIH vs Temperature
C024_SNVS821.png
Figure 2. IQ Shutdown vs Temperature
C023_SNVS821.png
Figure 4. POR Threshold vs Temperature
C026_SNVS821.pngFigure 6. PWM VIL vs Temperature