SNVS821A January   2014  – March 2014 LM3699

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Terminal Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 Handling Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 PWM Input
        1. 7.3.1.1 PWM Input Frequency Range
        2. 7.3.1.2 PWM Low Detect
      2. 7.3.2 HWEN Input
      3. 7.3.3 Current Select Inputs (IS1 And IS0)
      4. 7.3.4 ILOW Input
      5. 7.3.5 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Operation with an Unused Current Sink
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Step-by-Step Design Procedure
        2. 8.2.2.2 Maximum Output Power
          1. 8.2.2.2.1 Peak Current Limited
          2. 8.2.2.2.2 Output Voltage Limited
        3. 8.2.2.3 Boost Inductor Selection
        4. 8.2.2.4 Output Capacitor Selection
        5. 8.2.2.5 Schottky Diode Selection
        6. 8.2.2.6 Input Capacitor Selection
      3. 8.2.3 Application Performance Plots
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Boost Output Capacitor Placement
      2. 10.1.2 Schottky Diode Placement
      3. 10.1.3 Inductor Placement
      4. 10.1.4 Boost Input Capacitor Placement
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 Trademarks
    3. 11.3 Electrostatic Discharge Caution
    4. 11.4 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5 Terminal Configuration and Functions

DSBGA (YFQ)
12 Terminals
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Terminal Functions

TERMINAL DESCRIPTION
NUMBER NAME
A1 PWM PWM brightness control input. PWM is a high-impedance input and cannot be left floating.
A2 IS0 Current select input 1. This is a high-impedance input and cannot be left floating. IS0 can be connected to IN or GND.
A3 HWEN Hardware enable input. Drive this terminal high to enable the device. Drive this terminal low to force the device into a low-power shutdown. HWEN is a high-impedance input and cannot be left floating.
B1 HVLED1 Input terminal to high-voltage current sink 1 (24 V max). The boost converter regulates the minimum of HVLED1, HVLED2, and HVLED3 to VHR.
B2 IS1 Current select input 2. This is a high-impedance input and cannot be left floating. IS1 can be connected to IN or GND.
B3 IN Input voltage connection. Bypass IN to GND with a minimum 2.2-µF ceramic capacitor.
C1 HVLED2 Input terminal to high-voltage current sink 2 (24 V max). The boost converter regulates the minimum of HVLED1, HVLED2, and HVLED3 to VHR.
C2 ILOW Low level current enable. Drive this terminal high to reduce LED current by approximately 95%. ILOW is a high-impedance input and cannot be left floating. If not used connect to GND.
C3 GND Ground.
D1 HVLED3 Input terminal to high-voltage current sink 3 (24 V max). The boost converter regulates the minimum of HVLED1, HVLED2, and HVLED3 to VHR.
D2 OVP Overvoltage sense input. Connect OVP to the positive terminal of the inductive boost output capacitor (COUT).
D3 SW Drain connection for the internal NFET. Connect SW to the junction of the inductor and the Schottky diode anode.