SNVSA09D April   2014  – August 2017 LM43603

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Switching Characteristics
    8. 6.8 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Fixed Frequency Peak Current Mode Controlled Step-Down Regulator
      2. 7.3.2  Light Load Operation
      3. 7.3.3  Adjustable Output Voltage
      4. 7.3.4  Enable (EN)
      5. 7.3.5  VCC, UVLO and BIAS
      6. 7.3.6  Soft-Start and Voltage Tracking (SS/TRK)
      7. 7.3.7  Switching Frequency (RT) and Synchronization (SYNC)
      8. 7.3.8  Minimum ON-time, Minimum OFF-time and Frequency Foldback at Drop-Out Conditions
      9. 7.3.9  Internal Compensation and CFF
      10. 7.3.10 Bootstrap Voltage (BOOT)
      11. 7.3.11 Power Good (PGOOD)
      12. 7.3.12 Over Current and Short Circuit Protection
      13. 7.3.13 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Shutdown Mode
      2. 7.4.2 Stand-by Mode
      3. 7.4.3 Active Mode
      4. 7.4.4 CCM Mode
      5. 7.4.5 Light Load Operation
      6. 7.4.6 Self-Bias Mode
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1  Custom Design With WEBENCH® Tools
        2. 8.2.2.2  Output Voltage Set-Point
        3. 8.2.2.3  Switching Frequency
        4. 8.2.2.4  Input Capacitors
        5. 8.2.2.5  Inductor Selection
        6. 8.2.2.6  Output Capacitor Selection
        7. 8.2.2.7  Feed-Forward Capacitor
        8. 8.2.2.8  Bootstrap Capacitors
        9. 8.2.2.9  VCC Capacitor
        10. 8.2.2.10 BIAS Capacitors
        11. 8.2.2.11 Soft-Start Capacitors
        12. 8.2.2.12 Under Voltage Lockout Set-Point
        13. 8.2.2.13 PGOOD
      3. 8.2.3 Application Performance Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Compact Layout for EMI Reduction
      2. 10.1.2 Ground Plane and Thermal Considerations
      3. 10.1.3 Feedback Resistors
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
        1. 11.1.1.1 Custom Design With WEBENCH® Tools
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Related Links
    4. 11.4 Receiving Notification of Documentation Updates
    5. 11.5 Community Resources
    6. 11.6 Trademarks
    7. 11.7 Electrostatic Discharge Caution
    8. 11.8 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5 Pin Configuration and Functions

16-Pin HTSSOP (PWP)
Top View
LM43603 po_01_snvsa13.gif
16-Pin VSON (DSU)
Top View
LM43603 Package_Drawing_VSON.gif

Pin Functions

PIN DESCRIPTION
NAME NUMBER TYPE(1)
TSSOP VSON
SW 1,2 1,2,3 P Switching output of the regulator. Internally connected to both power MOSFETs. Connect to power inductor.
CBOOT 3 4 P Boot-strap capacitor connection for high-side driver. Connect a high quality 470-nF capacitor from CBOOT to SW.
VCC 4 5 P Internal bias supply output for bypassing. Connect bypass capacitor from this pin to AGND. Do not connect external loading to this pin. Never short this pin to ground during operation.
BIAS 5 6 P Optional internal LDO supply input. To improve efficiency, it is recommended to tie to VOUT when 3.3 V ≤ VOUT ≤ 28 V, or tie to an external 3.3 V or 5 V rail if available. When used, place a bypass capacitor (1 to 10 µF) from this pin to ground. Tie to ground when not in use. Do not float
SYNC 6 7 A Clock input to synchronize switching action to an external clock. Use proper high speed termination to prevent ringing. Connect to ground if not used. Do not float
RT 7 8 A Connect a resistor RT from this pin to AGND to program switching frequency. Leave floating for 500 kHz default switching frequency.
PGOOD 8 9 A Open drain output for power-good flag. Use a 10 kΩ to 100 kΩ pullup resistor to logic rail or other DC voltage no higher than 12 V.
FB 9 10 A Feedback sense input pin. Connect to the midpoint of feedback divider to set VOUT. Do not short this pin to ground during operation.
AGND 10 - G Analog ground pin. Ground reference for internal references and logic. Connect to system ground.
SS/TRK 11 11 A Soft-start control pin. Leave floating for internal soft-start slew rate. Connect to a capacitor to extend soft start time. Connect to external voltage ramp for tracking.
EN 12 12 A Enable input to the internal LDO and regulator. High = ON and low = OFF. Connect to VIN, or to VIN through resistor divider,or to an external voltage or logic source. Do not float.
VIN 13,14 13,14 P Supply input pins to internal LDO and high side power FET. Connect to power supply and bypass capacitors CIN. Path from VIN pin to high frequency bypass CIN and PGND must be as short as possible.
PGND 15,16 15,16 G Power ground pins, connected internally to the low side power FET. Connect to system ground, PAD, AGND, ground pins of CIN and COUT. Path to CIN must be as short as possible.
PAD - - - Low impedance connection to AGND. Connect to PGND on PCB . Major heat dissipation path of the die. Must be used for heat sinking to ground plane on PCB.
(1) P = Power, G = Ground, A = Analog