SNVS397E September   2005  – November 2016 LM5005

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 High-Voltage Start-Up Regulator
      2. 7.3.2 Shutdown and Standby
      3. 7.3.3 Oscillator and Synchronization Capability
      4. 7.3.4 Error Amplifier and PWM Comparator
      5. 7.3.5 RAMP Generator
      6. 7.3.6 Current Limit
      7. 7.3.7 Soft-Start Capability
      8. 7.3.8 MOSFET Gate Driver
    4. 7.4 Device Functional Modes
      1. 7.4.1 Shutdown Mode
      2. 7.4.2 Standby Mode
      3. 7.4.3 Light-Load Operation
      4. 7.4.4 Thermal Shutdown Protection
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Reducing Bias Power Dissipation
      2. 8.1.2 Input Voltage UVLO Protection
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1  Frequency Set Resistor (RT)
        2. 8.2.2.2  Inductor (LF)
        3. 8.2.2.3  Ramp Capacitor (CRAMP)
        4. 8.2.2.4  Output Capacitors (COUT)
        5. 8.2.2.5  Schottky Diode (DF)
        6. 8.2.2.6  Input Capacitors (CIN)
        7. 8.2.2.7  VCC Capacitor (CVCC)
        8. 8.2.2.8  Bootstrap Capacitor (CBST)
        9. 8.2.2.9  Soft Start Capacitor (CSS)
        10. 8.2.2.10 Feedback Resistors (RFB1 and RFB2)
        11. 8.2.2.11 RC Snubber (RS and CS)
        12. 8.2.2.12 Compensation Components (RC1, CC1, CC2)
        13. 8.2.2.13 Bill of Materials
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 PCB Layout for EMI Reduction
      2. 10.1.2 Thermal Design
      3. 10.1.3 Ground Plane Design
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Third-Party Products Disclaimer
    2. 11.2 Device Support
      1. 11.2.1 Development Support
    3. 11.3 Documentation Support
      1. 11.3.1 Related Documentation
        1. 11.3.1.1 PCB Layout Resources
        2. 11.3.1.2 Thermal Design Resources
    4. 11.4 Receiving Notification of Documentation Updates
    5. 11.5 Community Resources
    6. 11.6 Trademarks
    7. 11.7 Electrostatic Discharge Caution
    8. 11.8 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from D Revision (March 2013) to E Revision

  • Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information sectionGo
  • Deleted Simplified Application Schematic imageGo
  • Added Typical Application Circuit imageGo
  • Changed Junction to Ambient, RθJA, value in the Thermal Information table From: 40 To: 35.2Go
  • Changed Junction to Case, RθJC(bot), value in the Thermal Information table From: 4 To: 1.2Go
  • Changed Efficiency vs IOUT and VIN graphGo
  • Deleted RRAMP to VCC for VOUT > 7.5V figureGo
  • Added Connection of External Ramp Resistor to VCC when VOUT > 7.5 V figureGo

Changes from C Revision (March 2013) to D Revision

  • Changed layout of National Semiconductor Data Sheet to TI formatGo