SNVS300H July   2004  – September 2016 LM5111

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Options
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Switching Characteristics
    7. 7.7 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Undervoltage Lockout
      2. 8.3.2 Output Stage
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 VCC
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
    1. 10.1 Bias Supply Voltage
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
    3. 11.3 Thermal Considerations
      1. 11.3.1 Drive Power Requirement Calculations in LM5111
      2. 11.3.2 Continuous Current Rating of LM5111
  12. 12Device and Documentation Support
    1. 12.1 Receiving Notification of Documentation Updates
    2. 12.2 Community Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Pin Configuration and Functions

D and DGN Package
8-Pin SOIC and MSOP-PowerPAD
Top View
LM5111 20112301.gif

Pin Functions

PIN I/O DESCRIPTION
NAME NO.
IN_A 2 I ‘A’ side control input. TTL compatible thresholds.
IN_B 4 I ‘B’ side control input. TTL compatible thresholds.
OUT_A. 7 O Output for the ‘A’ side driver. Voltage swing of this output is from VCC to VEE. The output stage is capable of sourcing 3 A and sinking 5 A.
OUT_B 5 O Output for the ‘B’ side driver. Voltage swing of this output is from VCC to VEE. The output stage is capable of sourcing 3 A and sinking 5 A.
VCC 6 — Positive output supply. Locally decouple to VEE.
VEE 3 — Ground reference for both inputs and outputs. Connect to power ground.
NC 1, 8 — No Connection
Exposed Pad(1) — It is recommended that the exposed pad on the bottom of the package be soldered to ground plane on the PC board to aid thermal dissipation.
(1) Only available with the MSOP-PowerPAD package.