SNVSAJ6D July   2016  – December 2017 LM5141-Q1

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Simplified Schematic
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  High Voltage Start-up Regulator
      2. 7.3.2  VCC Regulator
      3. 7.3.3  Oscillator
      4. 7.3.4  Synchronization
      5. 7.3.5  Frequency Dithering (Spread Spectrum)
      6. 7.3.6  Enable
      7. 7.3.7  Power Good
      8. 7.3.8  Output Voltage
        1. 7.3.8.1 Minimum Output Voltage Adjustment
      9. 7.3.9  Current Sense
      10. 7.3.10 DCR Current Sensing
      11. 7.3.11 Error Amplifier and PWM Comparator
      12. 7.3.12 Slope Compensation
      13. 7.3.13 Hiccup Mode Current Limiting
      14. 7.3.14 Standby Mode
      15. 7.3.15 Soft Start
      16. 7.3.16 Diode Emulation
      17. 7.3.17 High- and Low-Side Drivers
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Custom Design With WEBENCH® Tools
        2. 8.2.2.2 Inductor Calculation
        3. 8.2.2.3 Current Sense Resistor
        4. 8.2.2.4 Output Capacitor
        5. 8.2.2.5 Input Filter
          1. 8.2.2.5.1 EMI Filter Design
          2. 8.2.2.5.2 MOSFET Selection
          3. 8.2.2.5.3 Driver Slew-Rate Control
          4. 8.2.2.5.4 Frequency Dithering
        6. 8.2.2.6 Control Loop
          1. 8.2.2.6.1 Feedback Compensator
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
      1. 10.1.1 Layout Procedure
    2. 10.2 Layout Examples
  11. 11Device and Documentation Support
    1. 11.1 Custom Design With WEBENCH® Tools
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • RGE|24
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from C Revision (February 2017) to D Revision

  • Added top navigator icon for TI Design reference design Go
  • Changed "CDS18534Q5A" to "CSD18534Q5A" to fix typoGo
  • Changed "+" to "×" in Equation 56Go

Changes from B Revision (January 2017) to C Revision

  • Changed the FBD with updates in the CS pin areaGo
  • Updated ISTEP definition in Equation 28Go

Changes from A Revision (July 2016) to B Revision

  • Added 'Systems' to the ADAS bullet in ApplicationsGo
  • Changed Description text From: 'conducted EMI' To: 'EMI'Go
  • Changed test conditions for RT parameter from: OSC = VDD to: OSC = GND Go
  • Changed equation unit From: '0.815 Apk' To: '0.815 A'Go
  • Changed equation unit From: '6.41 Apk' To: '6.41 A'Go
  • Changed equation unit From: '8.81 Apk' To: ' 8.81 A'Go
  • Changed equation unit From: '0.235 ARMS' To: '0.235 A'Go
  • Changed text From: 'a capacitance value greater than filter capacitor CIN' To: 'a capacitance value greater than 5 times the filter capacitor CIN' Go
  • Changed equation text From: '62A' and '105 nc' To: '(6A)2' and '105 nC'Go
  • Added GCS to equation definition listGo
  • Added Ω and µS symbols to equation textGo

Changes from * Revision (July 2016) to A Revision

  • Changed Product Preview to Production Data Release Go