SNIS197A August   2017  – April 2025 LM60-Q1

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 LM60-Q1 Transfer Function
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Capacitive Loads
    2. 8.2 Typical Applications
      1. 8.2.1 Full-Range Centigrade Temperature Sensor
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curve
      2. 8.2.2 Centigrade Thermostat Application
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
        3. 8.2.2.3 Application Curve
    3. 8.3 System Examples
      1. 8.3.1 Conserving Power Dissipation With Shutdown
    4. 8.4 Power Supply Recommendations
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
      2. 8.5.2 Layout Example
      3. 8.5.3 Thermal Considerations
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10 Revision History

Changes from Revision * (April 2017) to Revision A (April 2025)

  • Updated the numbering format for tables, figures, and cross-references throughout the document Go
  • Updated the Device Comparison section with existing OPNs and adding Device Nomenclature tableGo
  • Changed Machine model (MM) Electrostatic discharge to Charged-device model (CDM)Go
  • Changed DBZ package Thermal Information section for the New chipGo
  • Added “operating current” and “Change of quiescent current” for the New chipGo
  • Added graphs for new chip, reordered and corrected the graphs for legacy chipGo
  • Added corrections to the Thermal Resistance Junction to Air (Legacy chip) graphGo
  • Added Thermal Response in Stirred Oil Bath With Heat Sink (0.5 inches × 0.5 inches PCB board) graph for both Legacy and New chipsGo
  • Added Thermal Response in Stirred Oil Bath Without Heat Sink graph for both Legacy and New chipsGo
  • Added Thermal Response in Still Air Without a Heat Sink (Both Legacy and New chip together in a new test setup) graph for both Legacy and New chipsGo
  • Added the Start-Up Voltage vs Temperature, Quiescent Current vs Temperature, Accuracy vs Temperature, Noise Voltage, Supply Current vs Supply Voltage and Start-Up Response graphs for New chipGo