SLVSGD6A November   2021  – March 2022 LM66100-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics
  7. 7 Parameter Measurement Information
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Reverse Polarity Protection (RPP)
      2. 8.3.2 Always-ON Reverse Current Blocking (RCB)
    4. 8.4 Device Functional Modes
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 Dual Ideal Diode ORing
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curves
      2. 9.2.2 Dual Ideal Diode ORing for Continuous Output Power
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Application Curves
      3. 9.2.3 ORing with Discrete MOSFET
        1. 9.2.3.1 Design Requirements
        2. 9.2.3.2 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Receiving Notification of Documentation Updates
    2. 12.2 Support Resources
    3. 12.3 Trademarks
    4. 12.4 Electrostatic Discharge Caution
    5. 12.5 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5 Pin Configuration and Functions

GUID-448682AB-4D3F-4D2B-8797-97915CC18A3A-low.jpgFigure 5-1 DCK Package6-Pin SC-70Top View
Table 5-1 Pin Functions
PINI/ODESCRIPTION
NO.NAME
1VINIDevice input
2GND—Device ground
3CEIActive-low chip enable. Can be connected to VOUT for reverse current protection. Do not leave floating.
4N/C—Not internally connected, can be tied to GND or left floating.
5STOActive-low open-drain output, pulled low when the chip is disabled. Hi-Z when the chip is enabled. Connect to GND if not required.
6VOUTODevice output