SNOS926F May   1999  – September 2014 LM7372

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 Handling Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 ±15V DC Electrical Characteristics
    6. 6.6 ±15V AC Electrical Characteristics
    7. 6.7 ±5V DC Electrical Characteristics
    8. 6.8 ±5V AC Electrical Characteristics
  7. Typical Performance Characteristics
  8. Detailed Description
    1. 8.1 Functional Block Diagram
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
    3. 9.3 Application Details
      1. 9.3.1 High Frequency/Large Signal Swing Considerations
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
  12. 12Device and Documentation Support
    1. 12.1 Trademarks
    2. 12.2 Electrostatic Discharge Caution
    3. 12.3 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • DDA|8
  • D|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11 Layout

11.1 Layout Guidelines

Generally, a good high-frequency layout will keep power supply and ground traces away from the inverting input and output pins. Parasitic capacitance on these nodes to ground will cause frequency response peaking and possible circuit oscillations (see Application Note OA-15, "Frequent Faux Pas in Applying Wideband Current Feedback Amplifiers", SNOA367, for more information). Texas Instruments suggests the following evaluation boards as a guide for high frequency layout and as an aid in device testing and characterization:

Table 4. Printed Circuit Board Layout and Evaluation Boards

DEVICE PACKAGE EVALUATION BOARD PN
LM7372MA 16-Pin SOIC None
LM7372MR 8-Pin SO PowerPAD LMH730121

The DAP (die attach paddle) on the 8-Pin SO PowerPAD should be tied to V. It should not be tied to ground. See the respective Evaluation Board documentation.