SNOSBT0L February   2000  – September 2016 LM340

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
    1.     Available Packages
  3. 3 Description
    1.     Fixed Output Voltage Regulator
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 LM340A Electrical Characteristics, VO = 5 V, VI = 10 V
    6. 6.6 LM340 / LM7805 Electrical Characteristics, VO = 5 V, VI = 10 V
    7. 6.7 LM340 / LM7812 Electrical Characteristics, VO = 12 V, VI = 19 V
    8. 6.8 LM340 / LM7815 Electrical Characteristics, VO = 15 V, VI = 23 V
    9. 6.9 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Output Current
      2. 7.3.2 Current Limiting Feature
      3. 7.3.3 Thermal Shutdown
    4. 7.4 Device Functional Modes
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Shorting the Regulator Input
      2. 8.1.2 Raising the Output Voltage Above the Input Voltage
      3. 8.1.3 Regulator Floating Ground
      4. 8.1.4 Transient Voltages
    2. 8.2 Typical Applications
      1. 8.2.1 Fixed Output Voltage Regulator
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curve
    3. 8.3 System Examples
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Heat Sinking DDPAK/TO-263 and SOT-223 Package Parts
  11. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 Related Links
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Community Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)(2)
MIN MAX UNIT
DC input voltage 35 V
Internal power dissipation(3) Internally Limited
Maximum junction temperature 150 °C
Lead temperature (soldering, 10 sec.) TO-3 package (NDS) 300 °C
Lead temperature 1,6 mm (1/16 in) from case for 10 s 230 °C
Storage temperature −65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and specifications.
(3) The maximum allowable power dissipation at any ambient temperature is a function of the maximum junction temperature for operation (TJMAX = 125°C or 150°C), the junction-to-ambient thermal resistance (θJA), and the ambient temperature (TA). PDMAX = (TJMAX − TA)/θJA. If this dissipation is exceeded, the die temperature rises above TJMAX and the electrical specifications do not apply. If the die temperature rises above 150°C, the device goes into thermal shutdown. For the TO-3 package (NDS), the junction-to-ambient thermal resistance (θJA) is 39°C/W. When using a heat sink, θJA is the sum of the 4°C/W junction-to-case thermal resistance (θJC) of the TO-3 package and the case-to-ambient thermal resistance of the heat sink. For the TO-220 package (NDE), θJA is 54°C/W and θJC is 4°C/W. If SOT-223 is used, the junction-to-ambient thermal resistance is 174°C/W and can be reduced by a heat sink (see Applications Hints on heat sinking).If the DDPAK\TO-263 package is used, the thermal resistance can be reduced by increasing the PCB copper area thermally connected to the package: Using 0.5 square inches of copper area, θJA is 50°C/W; with 1 square inch of copper area, θJA is 37°C/W; and with 1.6 or more inches of copper area, θJA is 32°C/W.