SNVS754N January   2000  – April 2026 LM78L

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1  Absolute Maximum Ratings
    2. 5.2  ESD Ratings
    3. 5.3  Thermal Information
    4. 5.4  Recommended Operating Conditions
    5. 5.5  Electrical Characteristics: LM78L33 (New Chip Only)
    6. 5.6  Electrical Characteristics: LM78L05 (Legacy and New Chip)
    7. 5.7  Electrical Characteristics: LM78L06 (New Chip Only)
    8. 5.8  Electrical Characteristics: LM78L09 (Legacy Chip Only)
    9. 5.9  Electrical Characteristics: LM78L12 (Legacy and New Chip)
    10. 5.10 Electrical Characteristics: LM78L15 (Legacy and New Chip)
    11. 5.11 Electrical Characteristics: LM78L62 (Legacy Chip Only)
    12. 5.12 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Load Regulation
      2. 6.3.2 Protection
      3. 6.3.3 Current Limit
    4. 6.4 Device Functional Modes
      1. 6.4.1 Normal Operation
      2. 6.4.2 Dropout Operation
      3. 6.4.3 Shutdown
  8. 7 Application and Implementation
    1. 7.1 Application Information
    2. 7.2 Typical Applications
      1. 7.2.1 Design Requirements
      2. 7.2.2 Detailed Design Procedure
        1. 7.2.2.1 Input Capacitor
        2. 7.2.2.2 Output Capacitor
        3. 7.2.2.3 Power Dissipation (PD)
        4. 7.2.2.4 Estimating Junction Temperature
        5. 7.2.2.5 Overload Recovery
        6. 7.2.2.6 Reverse Current
        7. 7.2.2.7 Polarity Reversal Protection
      3. 7.2.3 Application Curve
      4. 7.2.4 Other Application Circuits
    3. 7.3 Power Supply Recommendations
    4. 7.4 Layout
      1. 7.4.1 Layout Guidelines
      2. 7.4.2 Layout Example
  9. 8 Device and Documentation Support
    1. 8.1 Device Support
      1. 8.1.1 Evaluation Module
      2. 8.1.2 Device Nomenclature
    2. 8.2 Documentation Support
      1. 8.2.1 Related Documentation
    3. 8.3 Receiving Notification of Documentation Updates
    4. 8.4 Support Resources
    5. 8.5 Trademarks
    6. 8.6 Electrostatic Discharge Caution
    7. 8.7 Glossary
  10. 9 Revision History
  11. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

9 Revision History

Changes from Revision M (February 2026) to Revision N (April 2026)

  • Updated new chip (300mm) specs and packages for clarity, added comparisons with legacy chip and a reference to Device Nomenclature in Features.Go
  • Added absolute maximum input voltage and temperature ranges of new and legacy chip to Features.Go
  • Updated typical uses listed in the Description Go
  • Updated PK package status from preview only to production dataGo
  • Updated Absolute Maximum Ratings to differentiate legacy and new chip.Go
  • Updated ESD Ratings to differentiate legacy and new chip.Go
  • Updated Thermal Information to differentiate legacy and new chip.Go
  • Updated Recommended Operating Conditions to differentiate legacy and new chip.Go
  • Updated Electrical Characteristics: LM78L33 (New Chip Only) with finalized specs for market release.Go
  • Updated new chip specs in Electrical Characteristics: LM78L05 (Legacy and New Chip).Go
  • Updated Electrical Characteristics: LM78L06 (New Chip Only) with finalized specs for market release.Go
  • Updated new chip specs in Electrical Characteristics: LM78L12 (Legacy and New Chip).Go
  • Updated new chip specs in Electrical Characteristics: LM78L15 (Legacy and New Chip).Go
  • Added plots for new chip, reordered plots for legacy chip, and changed condition statement in Typical Characteristics section.Go
  • Added Current Limit sectionGo
  • Updated wording for clarity in the Application Information sectionGo
  • Updated VIN nomenclature in the power dissipation equationGo
  • Changed graph title to specify legacy chip in the Application Curve section.Go
  • Changed the size of the SOT-89 image in the Layout Example section.Go
  • Updated SOIC package line items for clarity and added CSO in the Device Nomenclature tableGo

Changes from Revision L (June 2020) to Revision M (February 2026)

  • Added new chip (300mm) information, updated formattingGo
  • Updated the numbering format for tables, figures, and cross-references throughout the documentGo
  • Updated to include new chip informationGo
  • Added Evaluation Module sectionGo
  • Added nomenclature tableGo