SNLS474E February   2015  – June 2018 LMH1218

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Simplified SPI Schematic
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Descriptions – SPI Mode/ Mode_SEL = 1 kΩ to VDD
    2.     Pin Descriptions – SMBUS Mode/ MODE_SEL = 1 kΩ to GND
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Recommended SMBus Interface AC Timing Specifications
    7. 6.7 Serial Parallel Interface (SPI) Bus Interface AC Timing Specifications
    8. 6.8 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Loss of Signal Detector
      2. 7.3.2 Continuous Time Linear Equalizer (CTLE)
      3. 7.3.3 2:1 Multiplexer
      4. 7.3.4 Clock and Data Recovery
      5. 7.3.5 Eye Opening Monitor (EOM)
      6. 7.3.6 Fast EOM
        1. 7.3.6.1 SMBus Fast EOM Operation
        2. 7.3.6.2 SPI Fast EOM Operation
      7. 7.3.7 LMH1218 Device Configuration
        1. 7.3.7.1 MODE_SEL
        2. 7.3.7.2 ENABLE
        3. 7.3.7.3 LOS_INT_N
        4. 7.3.7.4 LOCK
        5. 7.3.7.5 SMBus MODE
        6. 7.3.7.6 SMBus READ/WRITE Transaction
        7. 7.3.7.7 SPI Mode
          1. 7.3.7.7.1 SPI READ/WRITE Transaction
          2. 7.3.7.7.2 SPI Write Transaction Format
          3. 7.3.7.7.3 SPI Read Transaction Format
        8. 7.3.7.8 SPI Daisy Chain
          1. 7.3.7.8.1 SPI Daisy Chain Write Example
          2. 7.3.7.8.2 SPI Daisy Chain Write Read Example
            1. 7.3.7.8.2.1 SPI Daisy Chain Length of Daisy Chain Illustration
      8. 7.3.8 Power-On Reset
    4. 7.4 Device Functional Modes
    5. 7.5 Programming
    6. 7.6 Register Maps
      1. 7.6.1 Global Registers
      2. 7.6.2 Receiver Registers
      3. 7.6.3 CDR Registers
      4. 7.6.4 Transmitter Registers
  8. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 General Guidance for All Applications
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curves
    3. 8.3 Do's and Don'ts
    4. 8.4 Initialization Set Up
      1. 8.4.1 Selective Data Rate Lock
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Solder Profile
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Receiving Notification of Documentation Updates
    4. 11.4 Community Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from D Revision (December 2017) to E Revision

  • Changed the note under Float(Default) setting from: Reserved to: Power down until valid signal detectedGo
  • Changed MISO pin I/O description from 3-Level back to 2-LevelGo
  • Changed the Acknowledge (ACK) graphic text from: Clock Line Held Low by Receiver While Interrupt is Serviced to: Host may held clock line low to delay transactionGo
  • Changed Channel Register 0x80 default from: 0xXX to: 0x20 Go
  • Changed the OUT0_VOD bit 7 default from x to 0Go
  • Changed the bit description for the OUT0_VOD bits 7-3 from: drv_0_sel_vod[3:0] default value may change from part to part to: drv_0_sel_vod[3:0] is typically 42 mV per step.Go
  • Changed the OUT0_VOD bit 6 default from x to 0Go
  • Changed the OUT0_VOD bit 5 default from x to 1Go
  • Changed the OUT0_VOD bit 4 default from x to 0Go

Changes from C Revision (December 2016) to D Revision

  • Changed Channel Register 0x80 default value from 0101 0100’b to XXXX 0000’bGo

Changes from B Revision (February 2016) to C Revision

  • Changed MISO pin I/O description from 2-Level to 3-LevelGo
  • Added test conditions to the source transmit differential launch amplitude parametersGo
  • Changed OUT0 VOD_Scaling_PD description for bits 7 through 4Go

Changes from A Revision (March 2015) to B Revision

Changes from * Revision (February 2015) to A Revision

  • Changed document status from Product Preview to Production Data Go