SNAS573D January   2012  – September 2021 LMK01801

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison
    1. 5.1 Functional Configurations
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 Recommended Operating Conditions
    3. 7.3 Thermal Information
    4. 7.4 Electrical Characteristics
    5. 7.5 Serial MICROWIRE Timing Diagram
    6. 7.6 Typical Characteristics
  8. 8 Parameter Measurement Information
    1. 8.1 Differential Voltage Measurement Terminology
  9. 9 Detailed Description
    1. 9.1 Overview
    2. 9.2 Functional Block Diagram
    3. 9.3 Feature Description
      1. 9.3.1  High-Speed Clock Inputs (CLKin0/CLKin0* and CLKin1/CLKin1*)
      2. 9.3.2  Clock Distribution
      3. 9.3.3  Small Divider (1 to 8)
      4. 9.3.4  Large Divider (1 to 1045)
      5. 9.3.5  CLKout Analog Delay
      6. 9.3.6  CLKout0 to CLKout11 Digital Delay
      7. 9.3.7  CLKout12 and CLKout13 Digital Delay
      8. 9.3.8  Programmable Outputs
      9. 9.3.9  Clock Output Synchronization
      10. 9.3.10 Default Clock Outputs
    4. 9.4 Device Functional Modes
      1. 9.4.1 Programmable Mode
      2. 9.4.2 Pin Control Mode
      3. 9.4.3 Inputs / Outputs
        1. 9.4.3.1 CLKin0 and CLKin1
      4. 9.4.4 Input and Output Dividers
      5. 9.4.5 Fixed Digital Delay
        1. 9.4.5.1 Fixed Digital Delay - Example
      6. 9.4.6 Clock Output Synchronization (SYNC)
        1. 9.4.6.1 Dynamically Programming Digital Delay
          1. 9.4.6.1.1 Relative Dynamic Digital Delay
          2. 9.4.6.1.2 Relative Dynamic Digital Delay - Example
    5. 9.5 Programming
      1. 9.5.1 Recommended Programming Sequence
        1. 9.5.1.1 Overview
    6. 9.6 Register Map
      1. 9.6.1 Default Device Register Settings After Power On/Reset
      2. 9.6.2 Register R0
        1. 9.6.2.1 RESET
        2. 9.6.2.2 POWERDOWN
        3. 9.6.2.3 CLKoutX_Y_PD
          1. 9.6.2.3.1 CLKinX_BUF_TYPE
          2. 9.6.2.3.2 CLKinX_DIV
          3. 9.6.2.3.3 CLKinX_MUX
      3. 9.6.3 Register R1 and R2
        1. 9.6.3.1 CLKoutX_TYPE
      4. 9.6.4 Register R3
        1. 9.6.4.1 CLKout12_13_ADLY
        2. 9.6.4.2 CLKout12_13_HS, Digital Delay Half Shift
        3. 9.6.4.3 SYNC1_QUAL
        4. 9.6.4.4 SYNCX_POL_INV
        5. 9.6.4.5 NO_SYNC_CLKoutX_Y
        6. 9.6.4.6 CLKoutX_Y_OFFSET_PD
        7. 9.6.4.7 SYNCX_FAST
        8. 9.6.4.8 SYNCX_AUTO
      5. 9.6.5 Register R4
        1. 9.6.5.1 CLKout12_13_DDLY, Clock Channel Digital Delay
      6. 9.6.6 Register R5
        1. 9.6.6.1 CLKout12_ADLY_SEL[13], CLKout13_ADLY_SEL[14], Select Analog Delay
        2. 9.6.6.2 CLKoutX_Y_DIV Clock Output Divide
      7. 9.6.7 Register 15
        1. 9.6.7.1 uWireLock
  10. 10Application and Implementation
    1. 10.1 Typical Application
      1. 10.1.1 Detailed Design Procedure
        1. 10.1.1.1 Driving CLKin Inputs
          1. 10.1.1.1.1 Driving CLKin Pins With a Differential Source
          2. 10.1.1.1.2 Driving CLKin Pins With a Single-Ended Source
        2. 10.1.1.2 Termination and Use of Clock Output (Drivers)
          1. 10.1.1.2.1 Termination for DC-Coupled Differential Operation
          2. 10.1.1.2.2 Termination for AC-Coupled Differential Operation
          3. 10.1.1.2.3 Termination for Single-Ended Operation
  11. 11Power Supply Recommendations
    1. 11.1 Current Consumption
  12. 12Layout
    1. 12.1 Layout Guidelines
      1. 12.1.1 Pin Connection Recommendations
        1. 12.1.1.1 Vcc Pins and Decoupling
        2. 12.1.1.2 Unused clock outputs
        3. 12.1.1.3 Unused clock inputs
        4. 12.1.1.4 Unused GPIO (CLKoutTYPE_X)
        5. 12.1.1.5 Bias
        6. 12.1.1.6 In MICROWIRE Mode
    2. 12.2 Thermal Management
  13. 13Device and Documentation Support
    1. 13.1 Documentation Support
    2. 13.2 Receiving Notification of Documentation Updates
    3. 13.3 Support Resources
    4. 13.4 Trademarks
    5. 13.5 Electrostatic Discharge Caution
    6. 13.6 Glossary
  14. 14Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5.1 Functional Configurations

Table 5-1 Clock Output Configurations
Bank Input Clock Group Output
CLKoutX/CLKoutX*		 Output Type Outputs in Divider Group Divider Ratios Delay
A CLKin0/CLKin0* CG1 0 to 3 LVDS/LVPECL 0 to 3 1 to 8 Fixed Digital(2)
CG2 4 to 7 LVDS/LVPECL/LVCMOS 4 to 7 1 to 8 Fixed Digital(2)
B CLKin1/CLKin1* CG3 8 to 11 LVDS/LVPECL/LVCMOS 8 to 11 1 to 8 Fixed Digital(2)
CG4 12 and 13 LVDS/LVPECL/LVCMOS 12 and 13 1 to 1045(1) Digital and Analog(3)
(1) Digital Delay will not work if CLKout12_13_DIV = 1.
(2) Fixed Digital Delay occurs when CLKoutX_Y_OFFSET_PD = 0. See Section 9.4.5.
(3) See Section 7.4
Table 5-2 Pin Control Mode for EN_PIN_CTRL = Low(1)
Pin Output Groups Pin=Low Pin=Middle Pin=High
CLKoutTYPE_0 CLKout0 to CLKout3 LVDS Powerdown LVPECL
CLKout4 to CLKout7 LVCMOS (Norm/Inv)
CLKoutTYPE_1 CLKout8 to CLKout11 LVDS LVCMOS (Norm/Inv) LVPECL
CLKoutTYPE_2 CLKout12 to CLKout13 LVDS LVCMOS (Norm/Inv) LVPECL
CLKoutDIV_0 CLKout0 to
CLKout3 Divider		 ÷ 1 ÷ 4 ÷ 2
CLKoutDIV_1 CLKout4 to
CLKout7 Divider		 ÷ 1 ÷ 4 ÷ 2
CLKoutDIV_2 CLKout8 to
CLKout11 Divider		 ÷ 1 ÷ 4 ÷ 2
CLKout12 to
CLKout13 Divider		 ÷ 8 ÷ 512 ÷ 16
(1) Floating is SPI. See Section 9.4.2.
Table 5-3 Pin Control Mode for EN_PIN_CTRL = High(1)(2)
Pin Output Groups Pin=Low Pin=Middle Pin=High
CLKoutTYPE_0 CLKout0 to CLKout3 LVDS LVPECL LVPECL
CLKout4 to CLKout7 LVCMOS (Norm/Inv)
CLKoutTYPE_1 CLKout8 to CLKout11 LVDS LVCMOS (Norm/Inv) LVPECL
CLKoutTYPE_2 CLKout12 to CLKout13 LVDS LVCMOS (Norm/Inv) LVPECL
CLKoutDIV_0 CLKout0 to
CLKout7 Dividers		 ÷ 1 ÷ 4 ÷ 2
CLKoutDIV_1 CLKout8 to
CLKout11 Divider		 ÷ 1 ÷ 4 ÷ 2
CLKoutDIV_2 CLKout12 to
CLKout13 Divider		 ÷ 4 ÷ 512 ÷ 16
(1) Digital Delay will not work if CLKout12_13_DIV = 1.
(2) See Section 7.4