SNAS835A September   2022  – February 2025 LMK5B33414

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Diagrams
    7. 6.7 Typical Characteristics
  8. 7 Parameter Measurement Information
    1. 7.1 Differential Voltage Measurement Terminology
    2. 7.2 Output Clock Test Configurations
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
      1. 8.2.1 PLL Architecture Overview
      2. 8.2.2 DPLL
        1. 8.2.2.1 Independent DPLL Operation
        2. 8.2.2.2 Cascaded DPLL Operation
        3. 8.2.2.3 APLL Cascaded With DPLL
      3. 8.2.3 APLL-Only Mode
    3. 8.3 Feature Description
      1. 8.3.1  Oscillator Input (XO)
      2. 8.3.2  Reference Inputs
      3. 8.3.3  Clock Input Interfacing and Termination
      4. 8.3.4  Reference Input Mux Selection
        1. 8.3.4.1 Automatic Input Selection
        2. 8.3.4.2 Manual Input Selection
      5. 8.3.5  Hitless Switching
        1. 8.3.5.1 Hitless Switching With Phase Cancellation
        2. 8.3.5.2 Hitless Switching With Phase Slew Control
        3. 8.3.5.3 Hitless Switching With 1PPS Inputs
      6. 8.3.6  Gapped Clock Support on Reference Inputs
      7. 8.3.7  Input Clock and PLL Monitoring, Status, and Interrupts
        1. 8.3.7.1 XO Input Monitoring
        2. 8.3.7.2 Reference Input Monitoring
          1. 8.3.7.2.1 Reference Validation Timer
          2. 8.3.7.2.2 Frequency Monitoring
          3. 8.3.7.2.3 Missing Pulse Monitor (Late Detect)
          4. 8.3.7.2.4 Runt Pulse Monitor (Early Detect)
          5. 8.3.7.2.5 Phase Valid Monitor for 1PPS Inputs
        3. 8.3.7.3 PLL Lock Detectors
        4. 8.3.7.4 Tuning Word History
        5. 8.3.7.5 Status Outputs
        6. 8.3.7.6 Interrupt
      8. 8.3.8  PLL Relationships
        1. 8.3.8.1  PLL Frequency Relationships
          1. 8.3.8.1.1 APLL Phase Frequency Detector (PFD) and Charge Pump
          2. 8.3.8.1.2 APLL VCO Frequency
          3. 8.3.8.1.3 DPLL TDC Frequency
          4. 8.3.8.1.4 DPLL VCO Frequency
          5. 8.3.8.1.5 Clock Output Frequency
        2. 8.3.8.2  Analog PLLs (APLL1, APLL2, APLL3)
        3. 8.3.8.3  APLL Reference Paths
          1. 8.3.8.3.1 APLL XO Doubler
          2. 8.3.8.3.2 APLL XO Reference (R) Divider
        4. 8.3.8.4  APLL Feedback Divider Paths
          1. 8.3.8.4.1 APLL N Divider With Sigma-Delta Modulator (SDM)
        5. 8.3.8.5  APLL Loop Filters (LF1, LF2, LF3)
        6. 8.3.8.6  APLL Voltage-Controlled Oscillators (VCO1, VCO2, VCO3)
          1. 8.3.8.6.1 VCO Calibration
        7. 8.3.8.7  APLL VCO Clock Distribution Paths
        8. 8.3.8.8  DPLL Reference (R) Divider Paths
        9. 8.3.8.9  DPLL Time-to-Digital Converter (TDC)
        10. 8.3.8.10 DPLL Loop Filter (DLF)
        11. 8.3.8.11 DPLL Feedback (FB) Divider Path
      9. 8.3.9  Output Clock Distribution
      10. 8.3.10 Output Source Muxes
      11. 8.3.11 Output Channel Muxes
      12. 8.3.12 Output Dividers (OD)
      13. 8.3.13 SYSREF/1PPS Output
      14. 8.3.14 Output Delay
      15. 8.3.15 Clock Output Drivers
        1. 8.3.15.1 Differential Output
        2. 8.3.15.2 LVCMOS Output
      16. 8.3.16 Clock Output Interfacing and Termination
      17. 8.3.17 Glitchless Output Clock Start-Up
      18. 8.3.18 Output Auto-Mute During LOL
      19. 8.3.19 Output Synchronization (SYNC)
      20. 8.3.20 Zero-Delay Mode (ZDM)
      21. 8.3.21 DPLL Programmable Phase Delay
      22. 8.3.22 Time Elapsed Counter (TEC)
        1. 8.3.22.1 Configuring TEC Functionality
        2. 8.3.22.2 SPI as a Trigger Source
        3. 8.3.22.3 GPIO Pin as a TEC Trigger Source
          1. 8.3.22.3.1 An Example: Making a Time Elapsed Measurement Using TEC and GPIO1 as Trigger
        4. 8.3.22.4 TEC Timing
        5. 8.3.22.5 Other TEC Behavior
    4. 8.4 Device Functional Modes
      1. 8.4.1 DPLL Operating States
        1. 8.4.1.1 Free-Run
        2. 8.4.1.2 Lock Acquisition
        3. 8.4.1.3 DPLL Locked
        4. 8.4.1.4 Holdover
      2. 8.4.2 Digitally-Controlled Oscillator (DCO) Frequency and Phase Adjustment
        1. 8.4.2.1 DPLL DCO Control
        2. 8.4.2.2 DPLL DCO Relative Adjustment Frequency Step Size
        3. 8.4.2.3 APLL DCO Frequency Step Size
      3. 8.4.3 APLL Frequency Control
      4. 8.4.4 Device Start-Up
        1. 8.4.4.1 Device Power-On Reset (POR)
        2. 8.4.4.2 PLL Start-Up Sequence
        3. 8.4.4.3 Start-Up Options for Register Configuration
        4. 8.4.4.4 GPIO1 and SCS_ADD Functionalities
        5. 8.4.4.5 ROM Page Selection
        6. 8.4.4.6 ROM Detailed Description
        7. 8.4.4.7 EEPROM Overlay
    5. 8.5 Programming
      1. 8.5.1 Memory Overview
      2. 8.5.2 Interface and Control
        1. 8.5.2.1 Programming Through TICS Pro
        2. 8.5.2.2 SPI Serial Interface
        3. 8.5.2.3 I2C Serial Interface
      3. 8.5.3 General Register Programming Sequence
      4. 8.5.4 Steps to Program the EEPROM
        1. 8.5.4.1 Overview of the SRAM Programming Methods
        2. 8.5.4.2 EEPROM Programming With the Register Commit Method
        3. 8.5.4.3 EEPROM Programming With the Direct Writes Method or Mixed Method
        4. 8.5.4.4 Five MSBs of the I2C Address and the EEPROM Revision Number
  10. 9 Application and Implementation
    1. 9.1 Application Information
      1. 9.1.1 Device Start-Up Sequence
      2. 9.1.2 Power Down (PD#) Pin
      3. 9.1.3 Strap Pins for Start-Up
      4. 9.1.4 Pin States
      5. 9.1.5 ROM and EEPROM
      6. 9.1.6 Power Rail Sequencing, Power Supply Ramp Rate, and Mixing Supply Domains
        1. 9.1.6.1 Power-On Reset (POR) Circuit
        2. 9.1.6.2 Power Up From a Single-Supply Rail
        3. 9.1.6.3 Power Up From Split-Supply Rails
        4. 9.1.6.4 Non-Monotonic or Slow Power-Up Supply Ramp
      7. 9.1.7 Slow or Delayed XO Start-Up
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
    3. 9.3 Best Design Practices
    4. 9.4 Power Supply Recommendations
      1. 9.4.1 Power Supply Bypassing
    5. 9.5 Layout
      1. 9.5.1 Layout Guidelines
      2. 9.5.2 Layout Example
      3. 9.5.3 Thermal Reliability
  11. 10Device and Documentation Support
    1. 10.1 Device Support
      1. 10.1.1 Development Support
        1. 10.1.1.1 Clock Tree Architect Programming Software
        2. 10.1.1.2 Texas Instruments Clocks and Synthesizers (TICS) Pro Software
        3. 10.1.1.3 PLLatinum™ Simulation Tool
    2. 10.2 Documentation Support
      1. 10.2.1 Related Documentation
    3. 10.3 Receiving Notification of Documentation Updates
    4. 10.4 Support Resources
    5. 10.5 Trademarks
    6. 10.6 Electrostatic Discharge Caution
    7. 10.7 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.3.10 Output Source Muxes

The LMK5B33414 employs 6 output source multiplexers or muxes (mux) to distribute frequency sources to the respective output banks. The 6:1 mux on OUT0 and OUT1 is the most flexible and provides selection among each APLL post divider, a buffered XO, or a buffered reference input as an output frequency source. The 3:1 muxes feeding the OUT2 and OUT3 bank can select a frequency source from the BAW APLL post divider, APLL2 post divider, and APLL1 primary post divider. The 2:1 muxes feeding the OUT4 to OUT13 bank can each select a frequency source from the BAW APLL post divider or the APLL2 post divider.

  • OUT0 and OUT1 each have a separate 6:1 mux to individually select an output source. Select the same output source mux option for OUT0 and OUT1 to reduce crosstalk.
  • OUT2 and OUT3 each have a separate 3:1 mux to individually select an output source. Select the same output source mux option for OUT2 and OUT3 to reduce crosstalk.
  • OUT4 and OUT5 share a 2:1 mux to select an output source. Select the same output source mux option for OUT4, OUT5, OUT6, and OUT7 to reduce crosstalk.
  • OUT6 and OUT7 share a 2:1 mux to select an output source. Select the same output source mux option for OUT4, OUT5, OUT6, and OUT7 to reduce crosstalk.
  • OUT8 and OUT9 share a 2:1 mux to select an output source. Select the same output source mux option for OUT8, OUT9, OUT10, OUT11, OUT12, and OUT13 to reduce crosstalk.
  • OUT10 and OUT11 share a 2:1 mux to select an output source. Select the same output source mux option for OUT8, OUT9, OUT10, OUT11, OUT12, and OUT13 to reduce crosstalk.
  • OUT12 and OUT13 share a 2:1 mux to select an output source. Select the same output source mux option for OUT8, OUT9, OUT10, OUT11, OUT12, and OUT13 to reduce crosstalk.

Table 8-6 lists the available options for the output source mux.

Table 8-5 Output Source Mux Options
OUTPUT SOURCE MUX OPTION OUTPUTS WITH OPTION DESCRIPTION
REFx OUT0, OUT1 Output channel mux is sourced from the selected reference input when R48[4:0] is configured and R78[5] is set.
R48[4:0] = 0x0 for none, 0x1 for REF0, 0x2 for REF1, 0x4 for REF2, 0x8 for REF3
XO OUT0, OUT1 Output channel mux is sourced from the XO input.
APLL1 PRI OUT0, OUT1, OUT2, OUT3 Output channel mux is sourced from the APLL1 primary post-divider output.
APLL1 SEC OUT0, OUT1 Output channel mux is sourced from the APLL1 secondary post-divider output.
APLL2 All OUTx Output channel mux is sourced from the APLL2 post-divider output.
APLL3 (BAW) All OUTx Output channel mux is sourced from the BAW APLL post-divider output.