SNAS826G April   2022  – March 2025 LMK6C , LMK6D , LMK6H , LMK6P

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Ordering Information
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Environmental Compliance
    4. 6.4 Recommended Operating Conditions
    5. 6.5 Thermal Information
    6. 6.6 Thermal Information
    7. 6.7 Electrical Characteristics
    8. 6.8 Timing Diagrams
    9. 6.9 Typical Characteristics
  8. 7 Parameter Measurement Information
    1. 7.1 Device Output Configurations
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Bulk Acoustic Wave (BAW)
      2. 8.3.2 Device Block-Level Description
      3. 8.3.3 Function Pins
      4. 8.3.4 Clock Output Interfacing and Termination
      5. 8.3.5 Temperature Stability
      6. 8.3.6 Mechanical Robustness
    4. 8.4 Device Functional Modes
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
      3. 9.2.3 Application Curves
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
        1. 9.4.1.1 Providing Thermal Reliability
        2. 9.4.1.2 Recommended Solder Reflow Profile
      2. 9.4.2 Layout
  11. 10Device and Documentation Support
    1. 10.1 Documentation Support
      1. 10.1.1 Related Documentation
    2. 10.2 Receiving Notification of Documentation Updates
    3. 10.3 Support Resources
    4. 10.4 Trademarks
    5. 10.5 Electrostatic Discharge Caution
    6. 10.6 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11 Revision History

Changes from Revision F (February 2025) to Revision G (March 2025)

  • Updated the number formatting for tables, figures, and cross-references throughout the documentGo
  • Added jitter specifications with PCIe Gen 7 throughout the documentGo
  • Added LMK6P Output DC-Coupled to LVPECL Receiver With External Termination/Biasing (50Ω to VDD - 2V) to show option for 50Ω to VDD-2V termination for LMK6PGo

Changes from Revision E (January 2024) to Revision F (February 2025)

  • Updated the number formatting for tables, figures, and cross-references throughout the documentGo
  • Changed the title of the Device Ordering Information section to "Device Nomenclature" and moved to the Device and Documentation Support section. Updated "Part Number Guide: LMK6C" Figure and added link to LMK6x OPN Decoder application note.Go
  • Changed Ensuring Thermal Reliability section title to "Providing Thermal Reliability"Go

Changes from Revision D (February 2023) to Revision E (January 2024)

  • Added values to the list of standard frequenciesGo
  • Changed the part number guides in the Device Ordering Information sectionGo

Changes from Revision C (December 2022) to Revision D (February 2023)

  • Changed the NO. column to DLE/DLF in the Pin Functions table for the DLF package releaseGo

Changes from Revision B (November 2022) to Revision C (December 2022)

  • Changed the data sheet status from Advanced Information to Production DataGo
  • Removed the preview note from the LMK6D, LMK6H, and LMK6P devicesGo