SNVSA10B November   2013  – November 2014 LMR14006

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 Handling Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Continuous Conduction Mode
      2. 7.3.2 Fixed Frequency Pwm Control
      3. 7.3.3 Sleep Mode
      4. 7.3.4 Bootstrap Voltage (CB)
      5. 7.3.5 Output Voltage Setting
      6. 7.3.6 Enable (/SHDN) and VIN Under Voltage Lockout
      7. 7.3.7 Current Limit
      8. 7.3.8 Overvoltage Transient Protection
      9. 7.3.9 Thermal Shutdown
  8. 8 Applications and Implementation
    1. 8.1 Typical Applications
      1. 8.1.1 Design Requirements
      2. 8.1.2 Detailed Design Procedure
        1. 8.1.2.1 Selecting The Switching Frequency
        2. 8.1.2.2 Output Inductor Selection
        3. 8.1.2.3 Output Capacitor
        4. 8.1.2.4 Schottky Diode
        5. 8.1.2.5 Input Capacitor
        6. 8.1.2.6 Bootstrap Capacitor Selection
      3. 8.1.3 Application Performance Curves
  9. 9 Layout
    1. 9.1 Layout Guidelines
    2. 9.2 Trademarks
    3. 9.3 Electrostatic Discharge Caution
    4. 9.4 Glossary
  10. 10Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted) (1)
PARAMETER MIN MAX UNIT
Input Voltages VIN to GND -0.3 45 V
SHDN to GND -0.3 45
FB to GND -0.3 7
CB to SW -0.3 7
Output Voltages SW to GND -1 45 V
SW to GND less than 30ns transients -2 45
TJ Operation Junction Temperature -40 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

6.2 Handling Ratings

MIN MAX UNIT
Tstg Storage temperature range -55 165 °C
V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins except CB pin(1) 1000 V
Charged device model (CDM), per JEDEC specification JESD22-C101, all pins(2) 500
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process, CB pin passes 500V test.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions (1)

Over operating free-air temperature range (unless otherwise noted)
PARAMETER MIN MAX UNIT
Buck Regulator VIN 4 40 V
CB 4 46 V
CB to SW -0.3 6 V
SW -1 40
FB 0 5.5 V
Control SHDN 0 40 V
Temperature Operating junction temperature range, TJ -40 125 °C

6.4 Thermal Information

THERMAL METRIC (1) TSOT
(6 PINS)		 UNIT
RθJA Junction-to-ambient thermal resistance 102 °C/W
RθJCtop Junction-to-case (top) thermal resistance 36.9
RθJB Junction-to board characterization parameter 28.4
(1) All numbers apply for packages soldered directly onto a 3" x 3" PC board with 2 oz. copper on 4 layers in still air in accordance to JEDEC standards. Thermal resistance varies greatly with layout, copper thickness, number of layers in PCB, power distribution, number of thermal vias, board size, ambient temperature, and air flow.

6.5 Electrical Characteristics

VIN = /SHDN = 12V, TA = 25°C, unless otherwise specified.
SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNIT
VIN (Input Power Supply)
VIN Operating input voltage 4 40 V
ISHDN Shutdown supply current VEN = 0V 1 3 µA
IQ Operating quiescent current (non- switching) no load, VIN = 12V 28 µA
UVLO Undervoltage lockout thresholds Rising threshold 4 V
Falling threshold 3
SHDN
VSHDN_Thre Rising SHDN Threshold Voltage 1.05 1.25 1.38 V
ISHDN_PIN Input current SHDN = 2.3V –4.2 µA
SHDN = 0.9V –1
ISHDN_HYS Hysteresis current –3 µA
HIGH-SIDE MOSFET
RDS_ON On-resistance VIN = 12V, CB to SW = 5.8V 600 mΩ
VOLTAGE REFERENCE (FB PIN)
VFB Feedback voltage 0.747 0.765 0.782 V
CURRENT LIMIT
ILIMIT Current limit VIN = 12V, TJ = 25°C 1200 mA
THERMAL PERFORMANCE
TSHDN Thermal shutdown threshold 170 ºC
THYS Hysteresis 10 ºC

6.6 Switching Characteristics

Over operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
SW (SW PIN)
fSW Switching frequency LMR14006X 935 1100 1285 kHz
LMR14006Y 1785 2100 2415
TON_MIN Minimum turn-on time fSW = 2.1 MHz 95 ns
DMAX Maximum duty cycle LMR14006X 96%
LMR14006Y 97%

6.7 Typical Characteristics

VIN = 12V, TA = 25°C, unless otherwise specified.
tc01_efficiency_2p1MHz_12V_snvsa10.png
fSW = 2.1 MHz VOUT = 12 V
Figure 2. Efficiency vs. Load Current
tc03_efficiency_2p1MHz_18V_snvsa10.png
fSW = 2.1 MHz
Figure 4. Efficiency vs. Load Current
tc05_load_regulation_snvsa10.png
VOUT = 5 V
Figure 6. Load Regulation
tc07_UVLO_vs_temp_snvsa10.png
Figure 8. UVLO vs Temperature
tc02_efficiency_2p1MHz_5V_snvsa10.png
fSW = 2.1 MHz VOUT = 5 V
Figure 3. Efficiency vs. Load Current
tc04_line_regulation_snvsa10.png
IOUT = 200 mA VOUT = 5 V
Figure 5. Line Regulation
tc06_supply_cur_vs_Vin_snvsa10.png
Figure 7. Supply Current vs Input Voltage (No Load)