SNVSAH9B December   2015  – March 2021 LMR16030

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Switching Characteristics
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Fixed Frequency Peak Current Mode Control
      2. 7.3.2  Slope Compensation
      3. 7.3.3  Sleep Mode
      4. 7.3.4  Low Dropout Operation and Bootstrap Voltage (BOOT)
      5. 7.3.5  Adjustable Output Voltage
      6. 7.3.6  Enable and Adjustable Undervoltage Lockout
      7. 7.3.7  External Soft Start
      8. 7.3.8  Switching Frequency and Synchronization (RT/SYNC)
      9. 7.3.9  Power Good (PGOOD)
      10. 7.3.10 Overcurrent and Short Circuit Protection
      11. 7.3.11 Overvoltage Protection
      12. 7.3.12 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Shutdown Mode
      2. 7.4.2 Active Mode
      3. 7.4.3 CCM Mode
      4. 7.4.4 Light Load Operation
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Custom Design With WEBENCH® Tools
        2. 8.2.2.2 Output Voltage Set-Point
        3. 8.2.2.3 Switching Frequency
        4. 8.2.2.4 Output Inductor Selection
        5. 8.2.2.5 Output Capacitor Selection
        6. 8.2.2.6 Schottky Diode Selection
        7. 8.2.2.7 Input Capacitor Selection
        8. 8.2.2.8 Bootstrap Capacitor Selection
      3. 8.2.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
      2. 11.1.2 Development Support
        1. 11.1.2.1 Custom Design With WEBENCH® Tools
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC (1)(2)LMR16030UNIT
DDA (HSOIC)
8 PINS
RθJAJunction-to-ambient thermal resistance42.5°C/W
ψJTJunction-to-top characterization parameter9.9°C/W
ψJBJunction-to-board characterization parameter25.4°C/W
RθJC(top)Junction-to-case (top) thermal resistance56.1°C/W
RθJC(bot)Junction-to-case (bottom) thermal resistance3.8°C/W
RθJBJunction-to-board thermal resistance25.5°C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953.
(2) Power rating at a specific ambient temperature TA should be determined with a maximum junction temperature (TJ) of 125°C, which is illustrated in the Recommended Operating Conditions.