SLUSDW3A April   2020  – November 2020 LMR50410

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Device Comparison Table
  6. 6 Pin Configuration and Functions
  7. 7 Specifications
    1. 7.1 Absolute Maximum Ratings
    2. 7.2 ESD Ratings
    3. 7.3 Recommended Operating Conditions
    4. 7.4 Thermal Information
    5. 7.5 Electrical Characteristics
    6. 7.6 Timing Requirements
    7. 7.7 Switching Characteristics
    8. 7.8 System Characteristics
    9. 7.9 Typical Characteristics
  8. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Fixed Frequency Peak Current Mode Control
      2. 8.3.2 Adjustable Output Voltage
      3. 8.3.3 Enable
      4. 8.3.4 Minimum ON-Time, Minimum OFF-Time, and Frequency Foldback
      5. 8.3.5 Bootstrap Voltage
      6. 8.3.6 Overcurrent and Short Circuit Protection
      7. 8.3.7 Soft Start
      8. 8.3.8 Thermal Shutdown
    4. 8.4 Device Functional Modes
      1. 8.4.1 Shutdown Mode
      2. 8.4.2 Active Mode
      3. 8.4.3 CCM Mode
      4. 8.4.4 Light-Load Operation (PFM Version)
      5. 8.4.5 Light-Load Operation (FPWM Version)
  9. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Design Requirements
      2. 9.2.2 Detailed Design Procedure
        1. 9.2.2.1 Custom Design With WEBENCH® Tools
        2. 9.2.2.2 Output Voltage Set-Point
        3. 9.2.2.3 Switching Frequency
        4. 9.2.2.4 Inductor Selection
        5. 9.2.2.5 Output Capacitor Selection
        6. 9.2.2.6 Input Capacitor Selection
        7. 9.2.2.7 Bootstrap Capacitor
        8. 9.2.2.8 Undervoltage Lockout Set-Point
      3. 9.2.3 Application Curves
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
      1. 11.1.1 Compact Layout for EMI Reduction
      2. 11.1.2 Feedback Resistors
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Device Support
      1. 12.1.1 Development Support
        1. 12.1.1.1 Custom Design With WEBENCH® Tools
    2. 12.2 Documentation Support
      1. 12.2.1 Related Documentation
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 Support Resources
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.5 Electrical Characteristics

Limits apply over operating junction temperature (TJ ) range of –40°C to +150°C, unless otherwise stated. Minimum and Maximum limits(1) are specified through test, design or statistical correlation. Typical values represent the most likely parametric norm at TJ = 25°C, and are provided for reference purposes only. Unless otherwise stated, the following conditions apply: VIN = 4 V to 36 V.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
SUPPLY VOLTAGE (VIN PIN)
VIN_UVLO Undervoltage lockout thresholds Rising threshold 3.55 3.75 4 V
Falling threshold 3.25 3.45 3.65 V
Hysteresis 0.3 V
IQ-nonSW Operating quiescent current (non-switching)(2) VEN = 3.3 V, VFB=1.1V (PFM variant only) 80 120 µA
ISD Shutdown quiescent current; measured at VIN pin VEN = 0 V 3 10 µA
ENABLE (EN PIN)
VEN-VOUT-H Enable input high-level for VOUT VENABLE rising 1.1 1.23 1.36 V
VEN-VOUT-L Enable input low-level for VOUT VENABLE falling 0.95 1.1 1.22 V
VEN-VOUT-HYS Enable input hysteresis for VOUT Hysteresis 130 mV
ILKG-EN Enable input leakage current VEN = 3.3V 10 200 nA
VOLTAGE REFERENCE (FB PIN)
VFB Feedback voltage 0.99 1 1.01 V
ILKG-FB Feedback leakage current FB = 1.2 V 0.2 nA
CURRENT LIMITS AND HICCUP
ISC High-side current limit(3) Vin=12V 1.25 1.6 1.9 A
ILS-LIMIT Low-side current limit(3) Vin=12V 0.9 1.1 1.3 A
IL-ZC Zero cross detector threshold PFM variants only 0.02 A
IL-NEG Negative current limit(3) FPWM variant only –0.6 A
MOSFETS
RDS-ON-HS High-side MOSFET ON-resistance TJ=25 ℃, VIN = 12 V 450 mΩ
RDS-ON-LS Low-side MOSFET ON-resistance TJ=25 ℃, VIN = 12 V 240 mΩ
THERMAL SHUTDOWN
TSD-Rising(1) Thermal shutdown Shutdown threshold 170 °C
TSD-Falling(1) Thermal shutdown Recovery threshold 158 °C
(1) MIN and MAX limits are 100% production tested at 25°C. Limits over the operating temperature range verified through correlation using
Statistical Quality Control (SQC) methods. Limits are used to calculate Average Outgoing Quality Level (AOQL).
(2) This is the current used by the device open loop. It does not represent the total input current of the system when in regulation.
(3) The current limit values in this table are tested, open loop, in production. They may differ from those found in a closed loop application.