SNOSAI7K September   2005  – May 2016 LMV651 , LMV652 , LMV654

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 3-V DC Electrical Characteristics
    6. 6.6 5-V DC Electrical Characteristics
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Low Voltage and Low Power Operation
      2. 7.3.2 Wide Bandwidth
      3. 7.3.3 Low Input Referred Noise
      4. 7.3.4 Ground Sensing and Rail-to-Rail Output
      5. 7.3.5 Small Size
    4. 7.4 Device Functional Modes
      1. 7.4.1 Stability and Capacitive Loading
      2. 7.4.2 In The Loop Compensation
      3. 7.4.3 Compensation By External Resistor
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 High Gain, Low Power Inverting Amplifiers
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curve
      2. 8.2.2 High Gain, Low Power Noninverting Amplifiers
      3. 8.2.3 Active Filters
    3. 8.3 Dos and Don'ts
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Development Support
    2. 11.2 Documentation Support
      1. 11.2.1 Related Documentation
    3. 11.3 Related Links
    4. 11.4 Community Resources
    5. 11.5 Trademarks
    6. 11.6 Electrostatic Discharge Caution
    7. 11.7 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

10 Layout

10.1 Layout Guidelines

To properly bypass the power supply, several locations on a printed-circuit board need to be considered. A
6.8-µF or greater tantalum capacitor must be placed at the point where the power supply for the amplifier is introduced onto the board. Another 0.1-µF ceramic capacitor must be placed as close as possible to the power supply pin of the amplifier. If the amplifier is operated in a single power supply, only the V+ pin needs to be bypassed with a 0.1-µF capacitor. If the amplifier is operated in a dual power supply, both V+ and V– pins must be bypassed.

It is good practice to use a ground plane on a printed-circuit board to provide all components with a low inductive ground connection.

Surface mount components in 0805 size or smaller are recommended in the LMV651-N application circuits. Designers can take advantage of the VSSOP miniature sizes to condense board layout in order to save space and reduce stray capacitance.

10.2 Layout Example

LMV651 LMV652 LMV654 Layout_3D.png Figure 41. LMV65x Layout Example