SNOS976M November   2001  – September 2016 LMV981-N , LMV982-N

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Description (continued)
  6. Pin Configuration and Functions
  7. Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Recommended Operating Conditions
    4. 7.4  Thermal Information
    5. 7.5  Electrical Characteristics - DC, 1.8 V
    6. 7.6  Electrical Characteristics - AC, 1.8 V
    7. 7.7  Electrical Characteristics - DC, 2.7 V
    8. 7.8  Electrical Characteristics - AC, 2.7 V
    9. 7.9  Electrical Characteristics - DC, 5 V
    10. 7.10 Electrical Characteristics - AC, 5 V
    11. 7.11 Typical Characteristics
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
    4. 8.4 Device Functional Modes
      1. 8.4.1 Input and Output Stage
      2. 8.4.2 Shutdown Mode
      3. 8.4.3 Input Bias Current Consideration
  9. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Applications
      1. 9.2.1 High-Side Current-Sensing Application
        1. 9.2.1.1 Design Requirements
        2. 9.2.1.2 Detailed Design Procedure
        3. 9.2.1.3 Application Curve
      2. 9.2.2 Half-Wave Rectifier Applications
        1. 9.2.2.1 Design Requirements
        2. 9.2.2.2 Detailed Design Procedure
        3. 9.2.2.3 Application Curves
      3. 9.2.3 Instrumentation Amplifier With Rail-to-Rail Input and Output Application
        1. 9.2.3.1 Design Requirements
        2. 9.2.3.2 Detailed Design Procedure
        3. 9.2.3.3 Application Curve
    3. 9.3 Do's and Don'ts
  10. 10Power Supply Recommendations
  11. 11Layout
    1. 11.1 Layout Guidelines
    2. 11.2 Layout Example
  12. 12Device and Documentation Support
    1. 12.1 Documentation Support
      1. 12.1.1 Related Documentation
    2. 12.2 Related Links
    3. 12.3 Receiving Notification of Documentation Updates
    4. 12.4 Community Resources
    5. 12.5 Trademarks
    6. 12.6 Electrostatic Discharge Caution
    7. 12.7 Glossary
  13. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

4 Revision History

Changes from L Revision (March 2013) to M Revision

  • Added Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information sectionGo
  • Changed RθJA values for LMV981-N: YZR (DSBGA) From: 286 To: 138.2Go
  • Changed RθJA values for LMV981-N: DCK (SC70) From: 286 To: 229.1Go
  • Changed RθJA values for LMV981-N: DBV (SOT-23) From: 286 To: 209.9Go
  • Changed RθJA values for LMV982-N: DGS (VSSOP) From: 286 To: 182.8Go

Changes from K Revision (March 2013) to L Revision

  • Changed layout of National Semiconductor Data Sheet to TI formatGo