SNVS852D June   2012  – August 2018 LMZ20502

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
    1.     Device Images
      1.      Simplified Schematic
      2.      Typical Efficiency for VOUT = 1.8 V Auto Mode
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
    1.     Pin Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 System Characteristics
    7. 6.7 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Nano Scale Package
      2. 7.3.2 Internal Synchronous Rectifier
      3. 7.3.3 Current Limit Protection
      4. 7.3.4 Start-Up
      5. 7.3.5 Dropout Behavior
      6. 7.3.6 Power Good Flag Function
      7. 7.3.7 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 PWM Operation
      2. 7.4.2 PFM Operation
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Detailed Design Procedure
        1. 8.2.1.1 Custom Design With WEBENCH® Tools
        2. 8.2.1.2 Setting The Output Voltage
        3. 8.2.1.3 Output and Feed-Forward Capacitors
        4. 8.2.1.4 Input Capacitors
        5. 8.2.1.5 Maximum Ambient Temperature
        6. 8.2.1.6 Options
      2. 8.2.2 Application Curves
    3. 8.3 Do's and Don'ts
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
    3. 10.3 Soldering Information
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
      2. 11.1.2 Development Support
        1. 11.1.2.1 Custom Design With WEBENCH® Tools
      3. 11.1.3 Documentation Support
        1. 11.1.3.1 Related Documentation
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Community Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information
    1. 12.1 Tape and Reel Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • SIL|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC(1) LMZ20502 UNIT
USIP (SIL)
8 PINS
RθJA Junction-to-ambient thermal resistance 42.6 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 20.8
RθJB Junction-to-board thermal resistance 9.4
ψJT Junction-to-top characterization parameter 1.5
ψJB Junction-to-board characterization parameter 9.3
RθJC(bot) Junction-to-case (bottom) thermal resistance 1.8
(1) The values given in this table are only valid for comparison with other packages and can not be used for design purposes. For design information please see the Maximum Ambient Temperature section. For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report.