SLOSEB7C September   2024  – September 2025 LOG300

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics Low Noise Amplifier (LNA) 
    6. 5.6 Electrical Characteristics Log Detector
    7. 5.7 Electrical Characteristics LNA + Log Detector (AFE)
    8. 5.8 Typical Characteristics: VCC = 5V
    9. 5.9 Typical Characteristics: VCC = 3.3V
  7. 6 Parameter Measurement Information
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Offset Correction Loop (OCL)
      2. 7.3.2 Single and Differential Input
      3. 7.3.3 Input Frequency Detect
    4. 7.4 Device Functional Modes
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Ultrasonic Distance Measurement
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
        3. 8.2.1.3 Application Curves
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Third-Party Products Disclaimer
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • RGT|16
  • D|16
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.4.1 Layout Guidelines

Follow these instructions to improve the performance and noise immunity of the LOG300:

  • Provide a star connection style supply for Freq_Supply and VCC. This connection enables better noise immunity and decoupling.
  • Design Log_Inp, Log_Inm and LNA_In traces with guard traces to improve immunity against noise pickup. Use shielding when possible to improve radiated noise immunity.
  • Place small capacitors on the AFE and LNA enable pins to allow high-frequency noise to be grounded before entering into the device.
  • As per Section 7.3.2, keep the impedance seen from Log_Inp and Log_Inm to the external circuit the same. Keep the trace length to Log_Inp and Log_Inm similar to keep impedance matched.
  • Keep minimal capacitance at the Freq_Out pin either by placing the load circuit close to the pin or by removing the analog ground plane under the output trace or both.
  • Dedicate one layer of the PCB for a solid analog ground pour to terminate all the capacitors used across the pins using sufficient vias.