SNOSCY7 June   2014 LP2996A

PRODUCTION DATA.  

  1. Features
  2. Applications
  3. Description
  4. Revision History
  5. Pin Configuration and Functions
    1. 5.1 Pin Descriptions
  6. Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 Handling Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Typical Performance Characteristics
  7. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
    4. 7.4 Device Functional Modes
  8. Applications and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Input Capacitor
      2. 8.1.2 Output Capacitor
      3. 8.1.3 Thermal Dissipation
    2. 8.2 Typical Application
      1. 8.2.1 Typical Application Circuit
      2. 8.2.2 DDR-III Applications
      3. 8.2.3 DDR-II Applications
      4. 8.2.4 SSTL-2 Applications
      5. 8.2.5 Level Shifting
        1. 8.2.5.1 Output Capacitor Selection
      6. 8.2.6 HSTL Applications
      7. 8.2.7 QDR Applications
  9. Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Examples
  11. 11Device and Documentation Support
    1. 11.1 Trademarks
    2. 11.2 Electrostatic Discharge Caution
    3. 11.3 Glossary
    4. 10.4 Glossary
  12. 12Mechanical, Packaging, and Orderable Information
  13. 11Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11 Device and Documentation Support

11.1 Trademarks

All other trademarks are the property of their respective owners.

11.2 Electrostatic Discharge Caution

esds-image

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.

11.3 Glossary

SLYZ022TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.