SNVSCD0A November   2023  – November 2023 LP5810

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
  8. 7 Typical Characteristics
  9. 8 Detailed Description
    1. 8.1 Overview
    2. 8.2 Functional Block Diagram
    3. 8.3 Feature Description
      1. 8.3.1 Analog Dimming
      2. 8.3.2 PWM Dimming
      3. 8.3.3 Autonomous Animation Engine Control
        1. 8.3.3.1 Animation Engine Pattern
        2. 8.3.3.2 Sloper
        3. 8.3.3.3 Animation Engine Unit (AEU)
        4. 8.3.3.4 Animation Pause Unit (APU)
      4. 8.3.4 Protections and Diagnostics
        1. 8.3.4.1 LED Open Detections
        2. 8.3.4.2 LED Short Detections
        3. 8.3.4.3 Thermal Shutdown
    4. 8.4 Device Functional Modes
    5. 8.5 Programming
      1. 8.5.1 I2C Data Transactions
      2. 8.5.2 I2C Data Format
  10. 9 Register Maps
  11. 10Application and Implementation
    1. 10.1 Application Information
    2. 10.2 Typical Application
      1. 10.2.1 Application
      2. 10.2.2 Design Parameters
      3. 10.2.3 Detailed Design Procedure
        1. 10.2.3.1 Input Capacitor Selection
        2. 10.2.3.2 Program Procedure
        3. 10.2.3.3 Programming Example
      4. 10.2.4 Application Performance Plots
    3. 10.3 Power Supply Recommendations
    4. 10.4 Layout
      1. 10.4.1 Layout Guidelines
      2. 10.4.2 Layout Example
  12. 11Device and Documentation Support
    1. 11.1 Documentation Support
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  13. 12Revision History
  14. 13Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

5 Pin Configuration and Functions

GUID-20220920-SS0I-Q3FW-GRN1-Q460XLGVPWXR-low.svg Figure 5-1 LP5810 YBH Package 9-Pin DSBGA Top View
GUID-20220920-SS0I-D3XL-TFXQ-WQVPFCCRZH9G-low.svg Figure 5-2 LP5810 DSD Package 8-Pin WSON Top View
Table 5-1 Pin Functions
PIN TYPE(1) DESCRIPTION
NAME YBH DSD
OUT0 A1 8 O Current sink 0. If not used, this pin can be floating or connecting to GND.
GND A2 Thermal pad G Ground. This pin must connect to the ground plane.
VCC A3 1 P Power supply of the device.
OUT1 B1 7 O Current sink 1. If not used, this pin can be floating or connecting to GND.
SYNC B2 2 I/O Clock synchronous among multiple devices. If not used, this pin can connect to ground to save power.
SCL B3 3 I I2C serial interface clock input.
OUT2 C1 6 O Current sink 2. If not used, this pin can be floating or connecting to GND.
OUT3 C2 5 O Current sink 3. If not used, this pin can be floating or connecting to GND.
SDA C3 4 I/O I2C serial interface data input/output.
(1) G: Ground Pin; P: Power Pin; I: Input Pin; I/O: Input/Output Pin; O: Output Pin.