SNVSD24A August   2025  – September 2026 LP5814I

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Timing Requirements
    7. 6.7 Timing Diagrams
    8. 6.8 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Analog Dimming
      2. 7.3.2 PWM Dimming
      3. 7.3.3 Sloper
      4. 7.3.4 Autonomous Animation Control
        1. 7.3.4.1 Animation Engine Unit
        2. 7.3.4.2 Animation Pattern Unit
        3. 7.3.4.3 Animation Control
      5. 7.3.5 Instant Blinking
      6. 7.3.6 Protections
        1. 7.3.6.1 UVLO
        2. 7.3.6.2 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Initialization Mode
      2. 7.4.2 Instant Blinking Mode
      3. 7.4.3 Standby and Normal Mode
      4. 7.4.4 Shutdown Mode
      5. 7.4.5 Thermal Shutdown Mode
    5. 7.5 Programming
      1. 7.5.1 I2C Data Transactions
      2. 7.5.2 I2C Data Format
      3. 7.5.3 Command Description
    6. 7.6 Register Maps
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Application
      2. 8.2.2 Design Parameters
      3. 8.2.3 Detailed Design Procedure
        1. 8.2.3.1 Program Procedure
        2. 8.2.3.2 Programming Example
      4. 8.2.4 Application Performance Plots
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Mechanical Data

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • YCH|8
Thermal pad, mechanical data (Package|Pins)
Orderable Information