SNVS861A February   2014  – August 2014 LP8754

PRODUCTION DATA.  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  Handling Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  General Electrical Characteristics
    6. 6.6  6-Phase Buck Electrical Characteristics
    7. 6.7  6-Phase Buck System Characteristics
    8. 6.8  Protection Features Characteristics
    9. 6.9  I2C Serial Bus Timing Parameters
    10. 6.10 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
      1. 7.1.1 Buck Information
    2. 7.2 Functional Block Diagram
    3. 7.3 Features Descriptions
      1. 7.3.1 Multi-Phase DC/DC Converters
        1. 7.3.1.1 Multi-Phase Operation and Phase-Shedding
        2. 7.3.1.2 Transitions Between Low-Power PFM, PFM, and PWM Modes
        3. 7.3.1.3 Buck Converter Load Current
        4. 7.3.1.4 Spread Spectrum Mode
      2. 7.3.2 Power-Up and Output Voltage Sequencing
      3. 7.3.3 Device Reset Scenarios
      4. 7.3.4 Diagnosis and Protection Features
        1. 7.3.4.1 Warnings for Diagnosis (No Power Down)
          1. 7.3.4.1.1 Short-Circuit Protection (SCP)
          2. 7.3.4.1.2 Power Good Monitoring
          3. 7.3.4.1.3 Thermal Warnings
        2. 7.3.4.2 Faults (Fault State and Fast Power Down)
          1. 7.3.4.2.1 Undervoltage Lock-out (UVLO)
          2. 7.3.4.2.2 Overvoltage Protection (OVP)
          3. 7.3.4.2.3 Thermal Shutdown (THSD)
    4. 7.4 Device Functional Modes
    5. 7.5 Programming
      1. 7.5.1 I2C-Compatible Interface
        1. 7.5.1.1 Data Validity
        2. 7.5.1.2 Start and Stop Conditions
        3. 7.5.1.3 Transferring Data
        4. 7.5.1.4 I2C-Compatible Chip Address
        5. 7.5.1.5 Auto-Increment Feature
    6. 7.6 Register Maps
      1. 7.6.1  Register Descriptions
      2. 7.6.2  VSET_B0
      3. 7.6.3  FPWM
      4. 7.6.4  BUCK0_CTRL
      5. 7.6.5  BUCK1_CTRL
      6. 7.6.6  BUCK2_CTRL
      7. 7.6.7  BUCK3_CTRL
      8. 7.6.8  BUCK4_CTRL
      9. 7.6.9  BUCK5_CTRL
      10. 7.6.10 FLAGS_0
      11. 7.6.11 FLAGS_1
      12. 7.6.12 INT_MASK_0
      13. 7.6.13 GENERAL
      14. 7.6.14 RESET
      15. 7.6.15 DELAY_BUCK0
      16. 7.6.16 CHIP_ID
      17. 7.6.17 PFM_LEV_B0
      18. 7.6.18 PHASE_LEV_B0
      19. 7.6.19 SEL_I_LOAD
      20. 7.6.20 LOAD_CURR
      21. 7.6.21 INT_MASK_2
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Inductor Selection
        2. 8.2.2.2 Input Capacitor Selection
        3. 8.2.2.3 Output Capacitor Selection
        4. 8.2.2.4 LDO Capacitor Selection
        5. 8.2.2.5 VIOSYS Capacitor Selection
      3. 8.2.3 Application Performance Plots
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 Trademarks
    3. 11.3 Electrostatic Discharge Caution
    4. 11.4 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

11 Device and Documentation Support

11.1 Device Support

11.1.1 Third-Party Products Disclaimer

TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE.

11.2 Trademarks

All other trademarks are the property of their respective owners.

11.3 Electrostatic Discharge Caution

esds-image

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

11.4 Glossary

SLYZ022 — TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.