SNVSBD1A August   2020  – February 2021 LP8866S-Q1

PRODUCTION DATA  

  1. 1 Features
  2. 2 Applications
  3. 3 Description
  4. 4 Revision History
  5. 5 Pin Configuration and Functions
  6. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
    6. 6.6 Logic Interface Characteristics
    7. 6.7 Timing Requirements for I2C Interface
    8.     14
    9. 6.8 Typical Characteristics
  7. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Control Interface
      2. 7.3.2 Function Setting
      3. 7.3.3 Device Supply (VDD)
      4. 7.3.4 Enable (EN)
      5. 7.3.5 Charge Pump
      6. 7.3.6 Boost Controller
        1. 7.3.6.1 Boost Cycle-by-Cycle Current Limit
        2. 7.3.6.2 Controller Min On/Off Time
        3. 7.3.6.3 Boost Adaptive Voltage Control
          1. 7.3.6.3.1 FB Divider Using Two-Resistor Method
          2. 7.3.6.3.2 FB Divider Using Three-Resistor Method
          3. 7.3.6.3.3 FB Divider Using External Compensation
        4. 7.3.6.4 Boost Sync and Spread Spectrum
        5. 7.3.6.5 Boost Output Discharge
        6. 7.3.6.6 Light Load Mode
      7. 7.3.7 LED Current Sinks
        1. 7.3.7.1 LED Output Current Setting
        2. 7.3.7.2 LED Output String Configuration
        3. 7.3.7.3 LED Output PWM Clock Generation
      8. 7.3.8 Brightness Control
        1. 7.3.8.1 Brightness Control Signal Path
        2. 7.3.8.2 Dimming Mode
        3. 7.3.8.3 LED Dimming Frequency
        4. 7.3.8.4 Phase-Shift PWM Mode
        5. 7.3.8.5 Hybrid Mode
        6. 7.3.8.6 Direct PWM Mode
        7. 7.3.8.7 Sloper
        8. 7.3.8.8 PWM Detector Hysteresis
        9. 7.3.8.9 Dither
      9. 7.3.9 Protection and Fault Detections
        1. 7.3.9.1 Supply Faults
          1. 7.3.9.1.1 VIN Undervoltage Faults (VINUVLO)
          2.        52
          3. 7.3.9.1.2 VIN Overvoltage Faults (VINOVP)
          4. 7.3.9.1.3 VDD Undervoltage Faults (VDDUVLO)
          5. 7.3.9.1.4 VIN OCP Faults (VINOCP)
            1. 7.3.9.1.4.1 VIN OCP Current Limit vs. Boost Cycle-by-Cycle Current Limit
          6. 7.3.9.1.5 Charge Pump Faults (CPCAP, CP)
          7. 7.3.9.1.6 CRC Error Faults (CRCERR)
        2. 7.3.9.2 Boost Faults
          1. 7.3.9.2.1 Boost Overvoltage Faults (BSTOVPL, BSTOVPH)
          2. 7.3.9.2.2 Boost Overcurrent Faults (BSTOCP)
          3. 7.3.9.2.3 LEDSET Resistor Missing Faults (LEDSET)
          4. 7.3.9.2.4 MODE Resistor Missing Faults (MODESEL)
          5. 7.3.9.2.5 FSET Resistor Missing Faults (FSET)
          6. 7.3.9.2.6 ISET Resistor Out of Range Faults (ISET)
          7. 7.3.9.2.7 Thermal Shutdown Faults (TSD)
        3. 7.3.9.3 LED Faults
          1. 7.3.9.3.1 Open LED Faults (OPEN_LED)
          2. 7.3.9.3.2 Short LED Faults (SHORT_LED)
          3. 7.3.9.3.3 LED Short to GND Faults (GND_LED)
          4. 7.3.9.3.4 Invalid LED String Faults (INVSTRING)
          5. 7.3.9.3.5 I2C Timeout Faults
        4. 7.3.9.4 Overview of the Fault and Protection Schemes
    4. 7.4 Device Functional Modes
      1. 7.4.1  State Diagram
      2. 7.4.2  Shutdown
      3. 7.4.3  Device Initialization
      4. 7.4.4  Standby Mode
      5. 7.4.5  Power-line FET Soft Start
      6. 7.4.6  Boost Start-Up
      7. 7.4.7  Normal Mode
      8. 7.4.8  Fault Recovery
      9. 7.4.9  Latch Fault
      10. 7.4.10 Start-Up Sequence
    5. 7.5 Programming
      1. 7.5.1 I2C-Compatible Interface
      2. 7.5.2 Programming Examples
        1. 7.5.2.1 General Configuration Registers
        2. 7.5.2.2 Clearing Fault Interrupts
        3. 7.5.2.3 Disabling Fault Interrupts
        4. 7.5.2.4 Diagnostic Registers
    6. 7.6 Register Maps
      1. 7.6.1 FullMap Registers
  8. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Full Feature Application for Display Backlight
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1  Inductor Selection
          2. 8.2.1.2.2  Output Capacitor Selection
          3. 8.2.1.2.3  Input Capacitor Selection
          4. 8.2.1.2.4  Charge Pump Output Capacitor
          5. 8.2.1.2.5  Charge Pump Flying Capacitor
          6. 8.2.1.2.6  Output Diode
          7. 8.2.1.2.7  Switching FET
          8. 8.2.1.2.8  Boost Sense Resistor
          9. 8.2.1.2.9  Power-Line FET
          10. 8.2.1.2.10 Input Current Sense Resistor
          11. 8.2.1.2.11 Feedback Resistor Divider
          12. 8.2.1.2.12 Critical Components for Design
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Application with Basic/Minimal Operation
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
        3. 8.2.2.3 Application Curves
      3. 8.2.3 SEPIC Mode Application
        1. 8.2.3.1 Design Requirements
        2. 8.2.3.2 Detailed Design Procedure
          1. 8.2.3.2.1  Inductor Selection
          2. 8.2.3.2.2  Coupling Capacitor Selection
          3. 8.2.3.2.3  Output Capacitor Selection
          4. 8.2.3.2.4  Input Capacitor Selection
          5. 8.2.3.2.5  Charge Pump Output Capacitor
          6. 8.2.3.2.6  Charge Pump Flying Capacitor
          7. 8.2.3.2.7  Switching FET
          8. 8.2.3.2.8  Output Diode
          9. 8.2.3.2.9  Switching Sense Resistor
          10. 8.2.3.2.10 Power-Line FET
          11. 8.2.3.2.11 Input Current Sense Resistor
          12. 8.2.3.2.12 Feedback Resistor Divider
          13. 8.2.3.2.13 Critical Components for Design
        3. 8.2.3.3 Application Curves
  9. 9 Power Supply Recommendations
  10. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  11. 11Device and Documentation Support
    1. 11.1 Device Support
      1. 11.1.1 Third-Party Products Disclaimer
    2. 11.2 Receiving Notification of Documentation Updates
    3. 11.3 Support Resources
    4. 11.4 Trademarks
    5. 11.5 Electrostatic Discharge Caution
    6. 11.6 Glossary
  12. 12Mechanical, Packaging, and Orderable Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

7.1 Overview

The LP8866S-Q1 device is a high-voltage LED driver for automotive infotainment, clusters, HUD and other automotive display LED backlight applications. PWM input is used for brightness control by default. Alternatively, the brightness can also be controlled by I2C Interface.

The boost frequency, LED PWM frequency, and LED string current are configured with external resistors through the BST_FSET, PWM_FSET, and ISET pins. The INT pin is used to report faults to the system. Fault interrupt status can be cleared with the I2C interface, or is cleared on the falling edge of the EN pin.

The LP8866S-Q1 supports pure PWM dimming. The six LED current drivers provide up to 150 mA per output and can be tied together to support higher current LEDs. The maximum output current of the LED drivers is set with the ISET resistor and can be optionally scaled by the LEDx_CURRENT[11:0] register bits with I2C interface. The LED output PWM frequency is set with a PWM_FSET resistor. The number of connected LED strings is configured by the LED_SET resistor, and the device automatically selects the corresponding phase shift mode. For example, if the device is set to 4-strings mode, each LED output is phase shifted by 90 degrees with each other(= 360 / 4). Unused outputs, which must be connected to GND, will be disabled and excluded from adaptive voltage and won't generate any LED faults.

A resistor divider connected from VOUT to the FB pin sets the maximum voltage of the boost. For best efficiency, the boost voltage is adapted automatically to the minimum necessary level needed to drive the LED strings by monitoring all the LED output voltages continuously. The switching frequency of the boost regulator can be set between 100 kHz and 2.2 MHz by the BST_FSET resistor. The boost has a start-up feature that reduces the peak current from the power-line during start-up. The LP8866S-Q1 can also control a power-line FET to reduce battery leakage when disabled and provide isolation and protection in the event of a fault.

Fault detection features of LP8866S-Q1 include:

  • Open-string and shorted LED detection
    • LED fault detection prevents system overheating in case of open or short in some of the LED strings
  • LED short-to-ground detection
  • ISET/BST_FSET/PWM_FSET/LED_SET/MODE resistor out-of-range detection
  • Boost overcurrent
  • Boost overvoltage
  • Device undervoltage protection (VDD UVLO)
    • Threshold sensing from VDD pin
  • VIN input overvoltage protection (VIN OVP)
    • Threshold sensing from VSENSE_P pin
  • VIN input undervoltage protection (VIN UVLO)
    • Threshold sensing from UVLO pin
  • VIN input overcurrent protection (VIN OCP)
    • Threshold sensing across voltage between VSENSE_P pin and VSENSE_N pin
  • Thermal shutdown in case of die overtemperature